[11p-W641-1~14] 8.2 Plasma deposition of thin film, plasma etching and surface treatment

△ [11p-W641-1] Optimization of Electrical Characterization Method of Plasma Process-Induced Damage in Si Substrates for the Analysis of Defect Profiles

〇Takashi Hamano¹, Keiichiro Urabe¹, Koji Eriguchi¹ (1.Kyoto Univ.)

Keywords:plasma etching, plasma-induced damage, Si