The 66th JSAP Spring Meeting, 2019

Presentation information

Oral presentation

8 Plasma Electronics » 8.2 Plasma deposition of thin film, plasma etching and surface treatment

[12a-W641-1~14] 8.2 Plasma deposition of thin film, plasma etching and surface treatment

Tue. Mar 12, 2019 9:00 AM - 12:45 PM W641 (W641)

Keigo Takeda(Meijo Univ.), Haruka Suzuki(Nagoya Univ.)

10:30 AM - 10:45 AM

[12a-W641-7] Investigation of uniform microwave plasma generation excited by slot antenna using electromagnetic field simulation

Taishin Shimada1, Takeshi Aizawa1, Tatsuo Ishijima1, Yasunori Tanaka1, Yoshihiko Uesugi1 (1.Kanazawa Univ.)

Keywords:resist, plasma, semiconductor

We are advancing research and development on microwave-excited water plasma ashing method as a new resist removal method. The microwave plasma is generated in an elliptical shape along an slot antenna. The elliptical plasma shape causes nonuniformity of the ashing rate in the wafer surface and there is concern about damage due to plasma irradiation after removing the resist. Therefore, we investigated the shape of the slot antenna which is effective for improving uniformity by using three - dimensional electromagnetic field simulation.