The 68th JSAP Spring Meeting 2021

Presentation information

Oral presentation

8 Plasma Electronics » 8.2 Plasma deposition of thin film, plasma etching and surface treatment

[17a-Z03-1~10] 8.2 Plasma deposition of thin film, plasma etching and surface treatment

Wed. Mar 17, 2021 9:00 AM - 11:45 AM Z03 (Z03)

Hisataka Hayashi(KIOXIA), Tomoko Ito(阪大)

11:00 AM - 11:15 AM

[17a-Z03-9] Lateral Etching of Aluminum Thin Film Deposited on Glass Substrate using Atmospheric-Pressure Plasma Jet (II)

Iori Hirashima1, Hiroshi Kuwahata1 (1.Toukai Univ.)

Keywords:atmospheric-pressure plasma jet, aluminum, etching

An aluminum (Al) thin film deposited on a glass substrate was irradiated with an atmospheric-pressure argon (Ar) plasma jet. The thin film was placed on an insulating plate and on a grounded metal plate during irradiation, and the two results were compared. For the Al thin film placed on the grounded metal plate during irradiation, the Al etching rate in the lateral direction increased approximately 1.6-fold.It was found that irradiating an Al thin film on a grounded metal plate with an atmospheric-pressure Ar plasma jet is effective for improving the Al etching rate in the lateral direction.