[16p-A403-1~20] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[16p-A403-19] Study of Highly Reliable Cu Dual-Damascene Interconnects using Ti Barrier for 3D Flash Memory

〇Junya Wada¹, Akira Nakajima¹, Yoshiki Aizawa¹, Masayuki Kitamura¹, Ryo Tanaka¹, Kotaro Fujii¹, Hisashi Kato¹, Masayoshi Tagami¹, Katsuyuki Sekine¹, Kazuya Ohuchi¹ (1.KIOXIA)

Keywords:interconnect, resistance