The 70th JSAP Spring Meeting 2023

Presentation information

Oral presentation

8 Plasma Electronics » 8.2 Plasma deposition of thin film, plasma etching and surface treatment

[17p-A205-1~18] 8.2 Plasma deposition of thin film, plasma etching and surface treatment

Fri. Mar 17, 2023 1:00 PM - 5:45 PM A205 (Building No. 6)

Kazuhiro Karahashi(Osaka univ.), Sumiko Fujisaki(Hitachi, Ltd.)

2:00 PM - 2:15 PM

[17p-A205-5] Application of technology for long-term retention of plasma treatment
:hydrophobic treatment

Kohshi Taguchi1, Tomikawa Mina1, Yamahara Motohiro1, Noborio Kazuyuki1 (1.SAKIGAKE-Semiconductor Co., Ltd.)

Keywords:Plasma, SAM, Hydrophobic

In the context of the demand for static and dynamic water repellency, we explored the possibility of controlling surface conditions using the SAM technology presented previously: as SAM raw materials, we used fluorinated and alkyl-based materials to control dynamic surface properties and static surface properties.
Details of the relationship between changes in properties, compositional and structural changes and water repellent conditions of the water-repellent sample surfaces will be discussed in the presentation on the same day.