[D-4-1] Self Assembled Viologen Modified Electrode as Mediator of Glucose Sensor

Dong-Yun Lee、A. K. M. Kafi、Sang-Hyun Park、Dong-Jin Qian、Young-Soo Kwon (1.Department of Electrical Engineering & CIIPMS, Dong-A University、2.Institute of Advanced Materials, Fudan University)

2006 International Conference on Solid State Devices and Materials |PDF ダウンロード

[D-4-2] Orientation and Electrical Conduction of Poly(3-hexylethiophene) Thin Film Prepared by Using a Different Solution-process Method

Suguru Mototani、Shizuyasu Ochiai、Shinnya Tanabe、Asao Ohashi、Yoshiyuki Uchida、Kenzo Kojima、Teruyoshi Mizutani (1.Dept. of Electrical Eng., Aichi Inst. of Tech.、2.Dept. of Electrical Eng., Aichi Inst. of Tech.)

2006 International Conference on Solid State Devices and Materials |PDF ダウンロード

[D-4-3] Theoretical Investigation of Electrical and Electronic Properties of Carbon Materials

Arunabhiram Chutia、Zhigang Zhu、Hideyuki Tsuboi、Michihisa Koyama、Akira Endou、Momoji Kubo、Carlos A. Del Carpio、Parasuraman Selvam、Akira Miyamoto (1.Department of Applied Chemistry, Graduate School of Engineering, Tohoku University、2.PRESTO, Japan Science and Technology Agency、3.New Industry Creation Hatchery Center, Tohoku University)

2006 International Conference on Solid State Devices and Materials |PDF ダウンロード

[D-5-1] Si Nano-photonics for LSI on-chip optical interconnection

Kenichi Nishi、Junichi Fujikata、Hirohito Yamada、Tsutomu Ishi、Masafumi Nakada、Koichi Nose、Masayuki Mizuno、Muneo Fukaishi、Yutaka Urino、Keishi Ohashi (1.NEC Corporation, Fundamental and Environmental Research Laboratories、2.NEC Corporation, System Devices Research Laboratories、3.NEC Corporation, System Platform Research Laboratories)

2006 International Conference on Solid State Devices and Materials |PDF ダウンロード

[D-5-2] 3D System Integration: Enabling Technologies and Applications

Peter Ramm (1.Fraunhofer Institute for Reliability and Microintegration, Munich Division)

2006 International Conference on Solid State Devices and Materials |PDF ダウンロード

[D-6-1] Real-time Observation of Hydrogen Plasma Reflow Process with Lead-free Solder Pastes

Shuichi Nishi、Eiji Higurashi、Tadatomo Suga、Taizoh Hagihara、Tatsuya Takeuchi、Yoshiharu Shingai、Sakie Yamagata、Rikiya Katoh、Kazuhiro Arase (1.School of Engineering, The University of Tokyo、2.Research Center for Advanced Science and Technology, The University of Tokyo、3.Shinko Seiki Co., Ltd.、4.Senju Metal Industry Co., Ltd.)

2006 International Conference on Solid State Devices and Materials |PDF ダウンロード

[D-6-2] The Reliability Characteristics of Wafer-Level Chip-Scale Package under Various Current Stressing

Heng-Yu Kung、Sheng Hsiung Chen、Yi-Shao Lai、Endruw Jahja、Wen-Kuan Yeh (1.Department of Electronic Engineering, National University of KaoHsiung、2.Department of Electrical Engineer, Tung Fang Institute of Technology、3.Stress-Reliability Lab, Advanced Semiconductor Engineering, Inc.)

2006 International Conference on Solid State Devices and Materials |PDF ダウンロード

[D-6-3] 65nm Node Transistor Characteristic Evaluation Technology for Assembly Stress and Assembly Stress Relaxation Design

Koji Takemura、Masao Takahashi、Hikari Sano、Koji Koike、Yutaka Itoh、Hiroshige Hirano (1.Matsushita Electric Industrial Co., Ltd.)

2006 International Conference on Solid State Devices and Materials |PDF ダウンロード

[D-7-2] Fowler-Nordheim Tunneling in Electromigrated Break Junctions with Porphyrin Derivatives

Yutaka Noguchi、Takashi Nagase、Rieko Ueda、Toshiya Kamikado、Tohru Kubota、Shinro Mashiko (1.Advanced ICT Research Center, National Institute of Information and Communications Technology)

2006 International Conference on Solid State Devices and Materials |PDF ダウンロード

[D-7-3] Effect of UV/ozone Treatment on Nanogap Electrodes for Molecular Devices

Touichiro Goto、Hiroshi Inokawa、Koji Sumitomo、Masao Nagase、Yukinori Ono、Keiichi Torimitsu (1.NTT Basic Research Laboratories, NTT Corporation、2.Research Institute of Electronics, Shizuoka University)

2006 International Conference on Solid State Devices and Materials |PDF ダウンロード