Interfacial Analysis of Low Temperature Deposited CVD-SiO<sub>2</sub> for Direct Bonding

Presentation information

Oral presentation

13 Semiconductors » 13.5 Semiconductor devices/ Interconnect/ Integration technologies

Thu. Mar 16, 2023 1:00 PM - 6:45 PM A403 (Building No. 6)

5:30 PM - 5:45 PM

〇Hayato Kitagawa¹, Koki Onishi¹, Tomoya Iwata¹, Junya Fuse¹, Akira Uedono², Fumihiro Inoue¹ (1.Yokokoku Univ., 2.Univ. of Tukuba)

Keywords:hybrid bonding, chiplet, 3D Intergration