〇Atsushi Okuyama¹, Suguru Saito¹, Yoshiya Hagimoto¹, Hayato Iwamoto¹, Kenji Nishi², Ayuta Suzuki³, Takayuki Toshima² (1.Sony Semiconductor Solutions, 2.Tokyo Electron Kyushu, 3.Tokyo Electron)

3:50 PM - 4:20 PM

[7p-C19-6] Semiconductor processes using multi-scale supercritical media

〇Eiichi Kondoh¹ (1.Univ. Yamanashi)

4:20 PM - 4:50 PM

[7p-C19-7] Electro-and electroless plating for nano to micro processes

〇Shoso Shingubara¹ (1.Kansai Univ.)

4:50 PM - 5:05 PM

△ [7p-C19-8] Electrical Properties of Fine Patterns Fabricated by the Electroless Deposition Process

〇Atsushi Hieno¹, Nakanishi tsutomu¹, Tanaka yusuke¹ (1.TOSHIBA)

5:05 PM - 5:20 PM

[7p-C19-9] A Novel Wafer Dicing Method Using Metal-Assisted Chemical Etching

〇Susumu Obata¹, Keiichiro Matsuo¹, Mitsuo Sano¹, Kazuhito Higuchi¹, Kazuo Shimokawa¹, Tsuyoshi Sato¹ (1.Toshiba Corporation)

5:20 PM - 5:25 PM

[7p-C19-10] Closing Remarks

〇Kazuyoshi Ueno¹ (1.Shibaura Inst. of Tech.)

Sessions

Symposium » Challenges for 'multi-scale' processing - dry, wet, or else?...

[7p-C19-1~10] Challenges for 'multi-scale' processing - dry, wet, or else?...

[7p-C19-1] Challenges for multi-scale processing - opening address -

[7p-C19-2] Interconnect Technologies on Ultra-Scaling and Ultra-3D-Stacking Era

[7p-C19-3] Atomic layer etching for 10 nm node and beyond

[7p-C19-4] Physics of Wet and Dry from a Viewpoint of Molecular Dynamics

[7p-C19-5] Impact of electrostatic effects on wet etching phenomenon in nanoscale region