The 78th JSAP Autumn Meeting, 2017

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[8a-C21-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Fri. Sep 8, 2017 9:15 AM - 12:00 PM C21 (C21)

Reo Kometani(Univ. of Tokyo)

9:45 AM - 10:00 AM

[8a-C21-3] Effect of carbon on boron clustering and diffusion in silicon studied by atom probe tomography

〇(D)Yuan Tu1, Yasuo Shimizu1, Masao Inoue2, Yorinobu Kunimune3, Yasuhiro Shimada3, Toshiharu Katayama3, Takashi Ide3, Koji Inoue1, Yasuyoshi Nagai1 (1.IMR, Tohoku Univ., 2.Renesas Electronics Corp., 3.Renesas Semiconductor Manufacturing Co., Ltd.)

Keywords:coimplantation, clustering, atom probe

Boron (B) implantation is widely used for p-type doping in silicon device fabrication. Carbon (C) co-implantation is a promising method to suppress B diffusion. Atom probe tomography (APT) is capable of obtaining a three-dimensional elemental distribution map with nearly atomic scale resolution. In this work, APT is used to investigate the effect of C on B clustering and diffusion. Our result indicate that the B cluster dissolving in B&C coimplanted sample is reduced by the presence of C, which is a possible reason for the suppression of B diffusion.