Oral presentation
13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology
Sat. Mar 17, 2018 9:30 AM - 12:30 PM C101 (52-101)
Takashi Noguchi(Univ. of the Ryukyus)
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▲：英語発表
▼：奨励賞エントリーかつ英語発表
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9:30 AM - 9:45 AM
〇Norihisa Takei1, Hiroaki Kakiuchi1, Kiyoshi Yasutake1, Hiromasa Ohmi1 (1.Osaka Univ.)
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9:45 AM - 10:00 AM
〇Yuri Mizukawa1, Wataru Nakano1, Hiroaki Hanafusa1, Seiichiro Higashi1 (1.Hiroshima Univ.)
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10:00 AM - 10:15 AM
〇Hiromu Harada1, Hiroaki Hanafusa1, Seiichiro Higashi1 (1.Graduate School of Advanced Sciences of Matter, Hiroshima University)
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10:15 AM - 10:30 AM
〇(B)Nobuaki Mino1, Ryo Yokogawa1,3, Takahiro Suzuki1, Kazuya Takahashi2, Kazuhiko Komori2, Tamotsu Morimoto2, Naomi Sawamoto1, Atsushi Ogura1 (1.Meiji Univ., 2.Tokyo Electron Technology Solutions Ltd., 3.JSPS Research Fellow)
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10:30 AM - 10:45 AM
〇Ryosuke Mochii1, Mami N. Fujii1, Yasuaki Ishikawa1, Yuta Sugawara2, Nobutake Nodera2, Takao Matsumoto2, Yukiharu Uraoka1 (1.NAIST, 2.SDP Corp.)
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10:45 AM - 11:00 AM
〇Mitsuhisa Hiraiwa1, Thuy Nguyen Thi1, Shin-Ichiro Kuroki1 (1.Hiroshima Univ.)
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11:15 AM - 11:30 AM
〇Nobuo Sasaki1,2, Muhammad Arif2, Yukiharu Uraoka2 (1.Sasaki Consulting, 2.NAIST)
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11:30 AM - 11:45 AM
Nobuo Sasaki1,2, 〇(M2)muhammad arif razali2, Yukiharu Uraoka2 (1.Sasaki Consulting, 2.NAIST)
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11:45 AM - 12:00 PM
〇Kaname Imokawa1,2, Nozomu Tanaka1, Akira Suwa1,2, Daisuke Nakamura1, Taizoh Sadoh1, Hiroshi Ikenoue1 (1.Kyushu Univ., 2.Gigaphoton Next GLP Kyushu Univ.)
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12:00 PM - 12:15 PM
〇Ryutatsu Mizukami1, Tomonori Yamashita1, Seiichiro Higashi1 (1.ADSM, Hiroshima Univ.)
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12:15 PM - 12:30 PM
〇Tomonori Yamashita1, Ryutatsu Mizukami1, Seiichiro Higashi1 (1.Graduate School of Advanced Sciences of Matter, Hiroshima Univ.)
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