4:00 PM - 4:15 PM
〇(B)Yoshiki Akita1, Akira Heya1, Naoto Matsuo1, Kazuyuki Kohama2, Kazuhiro Ito2 (1.univ.of Hyogo, 2.univ. of Osaka)
Oral presentation
13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology
Sat. Mar 17, 2018 4:00 PM - 5:30 PM C101 (52-101)
Seiichiro Higashi(Hiroshima Univ.)
△:奨励賞エントリー
▲:英語発表
▼:奨励賞エントリーかつ英語発表
空欄:どちらもなし
4:00 PM - 4:15 PM
〇(B)Yoshiki Akita1, Akira Heya1, Naoto Matsuo1, Kazuyuki Kohama2, Kazuhiro Ito2 (1.univ.of Hyogo, 2.univ. of Osaka)
4:15 PM - 4:30 PM
〇(D)Charith Jayanada Koswaththage1, Tatsuyuki Higashizako1, Tatsuya Okada1, Takashi Noguchi1, Hirosato Tanaka2, Mamoru Furuta2 (1.Univ. of the Ryukyus, 2.Kochi Uni. of Tech.)
4:30 PM - 4:45 PM
〇(DC)Masayuki Okugawa1, Ryusuke Nakamura1, Hiroshi Numakura1, Manabu Ishimaru2, Hidehiro Yasuda3 (1.Osaka Pref. Univ., 2.Kyushu Inst. Univ., 3.Osaka Univ.)
4:45 PM - 5:00 PM
〇(M1)Yuki Hanya1, Masayuki Okugawa1, Ryusuke Nakamura1, Hiroshi Numakura1, Goro Oohata1, Kohji Mizoguchi1, Manabu Ishimaru2, Hidehiro Yasuda3 (1.Osaka Pref. Univ., 2.Kyushu Inst. Univ., 3.Osaka Univ.)
5:00 PM - 5:15 PM
〇Takashi Noguchi1, Yuya Ishiki1, Futa Gakiya1, Tatsuya Okada1, Taro Morimura2, Atsushi Ota2, Yasushi Nishikata2 (1.Univ.f the Ryukyus, 2.ULVAC Inc.)
5:15 PM - 5:30 PM
〇(DC)Wu Li1, Naofumi Ueno1, Nagafumi Kato1, Masao Sakuraba1, Hisanao Akima1, Shigeo Sato1 (1.Tohoku Univ.)
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