Symposium (Oral)

[19p-B11-1~8] Interfacial Nano Electrochemistry - Diversification of Semiconductor Wet Process

Thu. Sep 19, 2019 1:30 PM - 5:00 PM B11 (B11)

Toshiyuki Sanada(Shizuoka Univ.), Yasuhito Yoshimizu(Toshiba Memory)

△：Presentation by Applicant for JSAP Young Scientists Presentation Award
▲：English Presentation
▼：Both of Above
No Mark：None of Above

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1:30 PM - 2:00 PM

[19p-B11-1] Recent Trends in Wet Etching of Si and Ge Surfaces: From Passivation to Machining

〇Kenta Arima¹ (1.Osaka Univ.)

2:00 PM - 2:30 PM

[19p-B11-2] Wet Etching of III-V Compound Semiconductors
– Focusing a Recent Topics on Nitride Semiconductors –

〇Taketomo Sato¹, Masachika Toguchi¹ (1.RCIQE, Hokkaido Univ.)

2:30 PM - 2:45 PM

[19p-B11-3] Consideration of surface reaction mechanism for III V compound semiconductor in water

〇Kenya Nishio¹, Takashi Oinoue¹, Suguru Saito¹, Yoshiya Hagimoto¹, Hayato Iwamoto¹, Yuuich Ogawa², Junichi ida² (1.Sony semiconductor Solutions Corp., 2.Kurita Water Industries LTD.)

2:45 PM - 3:00 PM

[19p-B11-4] Elucidation of saw marks flattening mechanism in Si etching using HF/HNO₃

〇Takashi Fukatani¹, Takashi Oinoue¹, Suguru Saito¹, Yoshiya Hagimoto¹, Hayato Iwamoto¹ (1.Sony Semiconductor Solutions)

3:15 PM - 3:45 PM

[19p-B11-5] Physical Cleaning of Diversified Electronic Devices
- Usefulness of Spray Cleaning And Their Problems -

〇Yoshiyuki Seike¹ (1.Aichi Inst. of Tech.)

3:45 PM - 4:15 PM

[19p-B11-6] Development subjects of cleaning technology for DRAM

〇Hideaki Yagi¹ (1.Micron Memory Japan TD)

4:15 PM - 4:45 PM

[19p-B11-7] Effectiveness and extendibility of wet process in next-generation three-dimensional flash memory manufacturing

〇Yasuhito Yoshimizu¹ (1.Toshiba memory Co.)

4:45 PM - 5:00 PM

[19p-B11-8] Effect of concertation of the etching solution on formation of Si-TSVs using metal-assisted chemical etching

〇Takuya Yorioka¹, Shunsuke Hanatani¹, Takeshi Ito¹, Tomohiro Shimizu¹, Shoso Shingubara¹ (1.Kansai Univ.)

Sessions

Symposium (technical) » Interfacial Nano Electrochemistry - Diversification of Semiconductor Wet Process