Oral presentation

[10a-W331-1~10] CS.4 Code-sharing Session of 3.15 & 3.16

Sun. Mar 10, 2019 9:15 AM - 12:15 PM W331 (W331)

Guangwei Cong(AIST), Hideki Yagi(Sumitomo Electric)

△：Presentation by Applicant for JSAP Young Scientists Presentation Award
▲：English Presentation
▼：Both of Above
No Mark：None of Above

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9:15 AM - 9:30 AM

▲ [10a-W331-1] Enhanced Ultraviolet Absorption in Graphene based on Metal-Dielectric-Metal Structure

Yijun Cai¹, Chengying Chen¹, 〇YI CHEN¹ (1.Xiamen Univ. of technology)

9:30 AM - 9:45 AM

▲ [10a-W331-2] Numerical analysis of Waveguide coupled graphene thermal emitter

〇(M2)Hanzhi Tang¹, Shinichi Takagi¹, Mitsuru Takenaka¹ (1.Univ. Tokyo)

9:45 AM - 10:00 AM

▲ [10a-W331-3] Quantum-Confined Direct-Gap Optical Absorption in Strained GeSn/Ge Multiple-Quantum-Well on Silicon

〇(M1)Kuan-Chih Lin¹, Yen-Hsin Lo¹, Chi-Wang Im¹, Guo-En Chang¹ (1.Nat. Chung Cheng Univ.)

10:00 AM - 10:15 AM

▲ [10a-W331-4] Investigation of Si Sidewall Bragg Grating for Hybrid III-V/SOI DFB Lasers

〇(M2)Moataz Eissa¹, Takuya Mitarai¹, Fumihitio Tachibana¹, Nobuhiko Nishiyama^1,2, Shigehisa Arai^1,2 (1.Titech EEE Dept., 2.Titech FIRST)

10:15 AM - 10:30 AM

▼ [10a-W331-5] All-optical serial-to-parallel conversion by nonlinear carrier-dispersion effects in silicon

〇(M2)Neranjith RanepuraHewage¹, Yuya Shoji¹, Tetsuya Mizumoto¹ (1.Tokyo Tech.)

10:45 AM - 11:15 AM

▲ [10a-W331-6] 【Highlight】[INVITED] A Versatile Silicon Photonics Platform for Integrated Optics Applications

〇Frederic Boeuf¹ (1.STMicroelectronics, Crolles, France)

11:15 AM - 11:30 AM

▲ [10a-W331-7] Investigation of Franz-Keldysh effect and carrier depletion effect in III-V/Si hybrid MOS optical modulator

〇(DC)Qiang Li¹, Chong Pei Ho¹, Shinichi Takagi¹, Mitsuru Takenaka¹ (1.Univ. of Tokyo)

11:30 AM - 11:45 AM

▲ [10a-W331-8] Investigation of impact of InGaAsP quantum well on the modulation efficiency of III-V/Si hybrid MOS optical modulator

〇(M2)Dongsheng Lyu¹, Qiang Li¹, Shinichi Takagi¹, Mitsuru Takenaka¹ (1.Univ. Tokyo)

11:45 AM - 12:00 PM

▼ [10a-W331-9] Investigation of stress dependence on bonding strength for III-V/Si chip-on-wafer by plasma activated bonding

〇Liu Bai¹, Takehiko Kikuchi^1,3, Takuya Mitarai¹, Nobuhiko Nishiyama^1,2, Hideki Yagi³, Tomohiro Amemiya^1,2, Shigehisa Arai^1,2 (1.Tokyo Tech, 2.IIR, 3.SEI)

12:00 PM - 12:15 PM

▲ [10a-W331-10] Investigation of InP/Si bonding condition for suppressing degradation of Photoluminescence property using Surface Activated Bonding

〇(M2)Yuning Wang¹, Takuya Mitarai¹, Tomohiro Amemiya^1,2, Nobuhiko Nishiyama^1,2, Shigehisa Arai^1,2 (1.Tokyo Tech, 2.FIRST)

Sessions

Code-sharing session » 【CS.4】Code-sharing Session of 3.15 & 3.16