The 66th JSAP Spring Meeting, 2019

Presentation information

Oral presentation

8 Plasma Electronics » 8.2 Plasma deposition of thin film, plasma etching and surface treatment

[11p-W641-1~14] 8.2 Plasma deposition of thin film, plasma etching and surface treatment

Mon. Mar 11, 2019 1:45 PM - 5:30 PM W641 (W641)

Daisuke Ogawa(Chubu Univ.), Kazunori Shinoda(HITACHI)

1:45 PM - 2:00 PM

[11p-W641-1] Optimization of Electrical Characterization Method of Plasma Process-Induced Damage in Si Substrates for the Analysis of Defect Profiles

Takashi Hamano1, Keiichiro Urabe1, Koji Eriguchi1 (1.Kyoto Univ.)

Keywords:plasma etching, plasma-induced damage, Si