The 66th JSAP Spring Meeting, 2019

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power electron devices and process technology

[12a-M121-1~9] 13.7 Compound and power electron devices and process technology

Tue. Mar 12, 2019 9:00 AM - 11:30 AM M121 (H121)

Keita Konishi(Tokyo Univ. of Agri. and Tech.)

9:15 AM - 9:30 AM

[12a-M121-2] Vertical Triple-Ion-Implanted β-Ga2O3 MOSFETs with Nitrogen-Doped Current Blocker

ManHoi Wong1, Ken Goto2,3, Hisashi Murakami2, Yoshinao Kumagai2, Masataka Higashiwaki1 (1.NICT, 2.Tokyo Univ. Agricul. Technol., 3.Tamura Corp.)

Keywords:Ga2O3, vertical MOSFET, ion implantation

Vertical power switching devices are desirable for high-voltage applications since they allow for superior field termination, high current drives, and simplified thermal management. β-Ga2O3 is amenable to doping with both shallow donors (Si) and deep acceptors (Mg, N) by ion implantation with efficient dopant activation at a low thermal budget, thereby enabling device fabrication by a highly manufacturable all-ion-implanted process resembling that for SiC MOSFETs. In this work, a current aperture vertical β-Ga2O3 MOSFET is demonstrated by integration N-ion and Si-ion implantation doping.