The 83rd JSAP Autumn Meeting 2022

Presentation information

Oral presentation

8 Plasma Electronics » 8.2 Plasma deposition of thin film, plasma etching and surface treatment

[23a-B101-1~10] 8.2 Plasma deposition of thin film, plasma etching and surface treatment

Fri. Sep 23, 2022 9:00 AM - 11:45 AM B101 (B101)

Kosuke Takenaka(Osaka Univ.), Giichiro Uchida(Meijo Univ)

10:30 AM - 10:45 AM

[23a-B101-6] Development and basic performance evaluation of dielectric barrier discharge device using transparent electrode to realize simultaneous UV/NIR and plasma treatment

ZHIZHI LIU1, Motoaki Yamauchi1, Mao Xu1, Taiki Osawa1, Akitoshi Okino1 (1.FIRST, Tokyo Tech.)

Keywords:plasma, dielectric barrier discharge, surface treatment

Dielectric barrier discharge (DBD) is widely used for surface treatment of sheet materials because it can stably generate large-area plasma under atmospheric pressure. However, since it is difficult to generate high-density plasma with DBD, there is a problem that it is difficult to achieve high processing speed. In this research, we have developed a DBD device that uses transparent electrodes, and realized that plasma and ultraviolet rays or infrared rays can be simultaneously applied to the surface to be treated. In this talk, we will present the outline of this device and the basic characteristics of the hydrophilization treatment.