The Japan Society of Applied Physics

[PS-14-08] High Temperature SiC Power Module Enhanced with Transient Thermal Characteristic by Al-bump Technology

H. Tanisawa1,2, F. Kato1, K. Koui1,3, S. Sato1, K. Watanabe1, H. Takahashi1,4, Y. Murakami1,5, H. Sato1 (1.AIST (Japan), 2.Sanken electric Corp., Ltd. (Japan), 3.Calsonic Kansei Corp. (Japan), 4.Fuji Electric Co., Ltd. (Japan), 5.NISSAN MOTOR Corp., Ltd. (Japan))

2017 International Conference on Solid State Devices and Materials |2017年9月21日(木) 11:49 〜 11:51 |PDF ダウンロード