[E-4-06] Enabling area efficient oxide channel Fe-TFT based TCAM cell through monolithic 3D integration with low temperature annealing

〇Hongrae Joh¹, Sooji Nam², Minhyun Jung¹, Sung Haeng Cho², Sanghun Jeon¹ (1. Korea Advanced Institute of Science and Technology (KAIST) (Korea), 2. Electronics and Telecommunications Research Institute (Korea))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 11:00 AM - 11:15 AM |PDF Download

[E-6-01 (Invited)] Robust Molecular Recognition Electronics using Metal Oxide Nanostructures

〇Takeshi Yanagida¹ (1. Univ. of Tokyo / Kyushu Univ. (Japan))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 1:30 PM - 2:00 PM |PDF Download

[E-6-02] Indium oxide-based thin film transistor with high CO₂ sensitive (400) plane

〇Ayumu Nodera¹, Shun Mori¹, Shinya Aikawa¹ (1. Kogakuin University (Japan))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 2:00 PM - 2:15 PM |PDF Download

[E-6-03] Developing SnO₂ Based Flexible Humidity Sensor on Ultra-Soft Substrate for Breath Detection

〇Moumita Deb¹, Po- Yi Chang^1,2,3, Pin- Hsuan Li¹, Ming- Jen Chen^4,5, Ya- Chuang Tian^4,5, Olivier Soppera^2,3, Hsiao- Wen Zan¹ (1. Department of Photonics, College of Electrical and Computer Engineering, National Yang Ming Chiao Tung Univ. (Taiwan), 2. Université de Haute-Alsace, CNRS (France), 3. Université de Strasbourg (France), 4. Department of Medicine, Chang Gung Univ. (Taiwan), 5. Kidney Research Center and Department of Nephrology, Linkou Chang Gung Memorial Hospital (Taiwan))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 2:15 PM - 2:30 PM |PDF Download

[E-6-04] A Novel Poly-Si/IGZO Thin-Film Transistor Process Platform for Sensor Applications

〇Ping-Che Liu¹, Jen-Chi Liao¹, Chun-Jung Su², Pei-Wen Li¹, Horng-Chih Lin¹ (1. Inst. of Electronics, National Yang Ming Chiao Tung Univ. (Taiwan), 2. Department of Electrophysics, National Yang Ming Chiao Tung Univ. (Taiwan))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 2:30 PM - 2:45 PM |PDF Download

[E-6-05] The use of local etching and NiO capping layer to improve the performance of ultraviolet photodetectors based on SiZnSnO thin film transistors

〇Wen-Hung Lai¹, Wei-Wen Chen¹, Rong-Ming Ko², Chao-Yen Chang¹, Chien-Hung Wu³, Shui-Jinn Wang¹ (1. Inst. of Microelectronics, Dept. of Electrical Eng., Univ. of National Cheng Kung University (Taiwan), 2. Academy of Innovative Semiconductor and Sustainable Manufacturing, Univ. of National Cheng Kung University (Taiwan), 3. Dept. of Optoelectronics and Materials Eng., Chung Hua University (Taiwan))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 2:45 PM - 3:00 PM |PDF Download

[E-6-06] Ultraviolet photodetector based on a SiZnSnO thin film transistor with a stacked channel structure and a patterned NiO capping layer

〇Hao-Che Cheng¹, Wei-Ting Chen¹, Rong-Ming Ko², Chao-Yen Chang¹, Chien-Hung Wu³, Shui-Jinn Wang¹ (1. Inst. of Microelectronics, Dept. of Electrical Eng., Univ. of National Cheng Kung University (Taiwan), 2. Academy of Innovative Semiconductor and Sustainable Manufacturing, Univ. of National Cheng Kung University (Taiwan), 3. Dept. of Optoelectronics and Materials Eng., Chung Hua University (Taiwan))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 3:00 PM - 3:15 PM |PDF Download

[E-6-07] Nitrogen incorporation in SnO₂ matrix for passivation of oxygen vacancy and hole generation

〇Kotaro Watanabe¹, Takuma Kawaguchi¹, Shinya Aikawa¹ (1. Kogakuin Univ. (Japan))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 3:15 PM - 3:30 PM |PDF Download

[【Cancelled】E-7-01 (Invited)] Strategy of Wafer Bonding Techniques in Commercial MEMS

〇Tadashi Inoue¹ (1. MMI Semiconductor Co., Ltd. (Japan))

2022 International Conference on Solid State Devices and Materials |Thu. Sep 29, 2022 9:00 AM - 9:30 AM |PDF Download

[E-7-02] Fabrication and Characterization of Through-X Via (TXV) for Smart Skin Display

〇Tadaaki Hoshi¹, Yuki Susumago¹, Liu Chang¹, Atsushi Shinoda², Hisashi Kino³, Tetsu Tanaka^1,3, Takafumi Fukushima^1,3 (1. Dept. of Mechanical Systems Engineering, Graduate School of Engineering, Univ. of Tohoku (Japan), 2. Dept. of Mechanical and Aerospace Engineering, School of Engineering, Univ of Tohoku (Japan), 3. Dept. of Biomedical Engineering, Graduate School of Biomedical Engineering, Univ. of Tohoku (Japan))

2022 International Conference on Solid State Devices and Materials |Thu. Sep 29, 2022 9:30 AM - 9:45 AM |PDF Download