[K-3-01 (Invited)] Wafer Bonding Advances and 3D Applications

〇Hiroshi Yamamoto¹ (1. EV Group Japan (Japan))

2022 International Conference on Solid State Devices and Materials |Tue. Sep 27, 2022 4:15 PM - 4:45 PM |PDF Download

[K-3-02 (Invited)] Advances in monolithic high-speed SiGe photonic electronic system integration

〇Lars Zimmermann¹ (1. IHP (Germany))

2022 International Conference on Solid State Devices and Materials |Tue. Sep 27, 2022 4:45 PM - 5:15 PM |PDF Download

[K-3-03 (Invited)] Advanced Encapsulants for Compound Semiconductor Package

〇Kuo-Chan Chiou¹ (1. Industrial Technology Research Institute (Taiwan))

2022 International Conference on Solid State Devices and Materials |Tue. Sep 27, 2022 5:15 PM - 5:45 PM |PDF Download

[K-4-01 (Invited)] Heterogenous Integration on Flexible Substrates

〇Subramanian S. Iyer¹ (1. ULCA (United States of America))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 9:00 AM - 9:30 AM |PDF Download

[K-4-02] Failure Analyses and Yield Enhancement of Electroplated Cu Direct Bonding for Heterogeneous 3D and Micro-LED Integration

〇Yuki Susumago¹, Tadaaki Hoshi¹, Chang Liu¹, Atushi Shinoda², Hisashi Kino³, Tetsu Tanaka^1,3, Takafumi Fukushima^1,3 (1. Graduate School of Eng., Tohoku Univ. (Japan), 2. School of Eng., Tohoku Univ. (Japan), 3. Graduate School of Biomed. Eng., Tohoku Univ. (Japan))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 9:30 AM - 9:45 AM |PDF Download

[K-4-03] Surface Activated Bonding of ALD Al₂O₃ films

〇Junsha Wang¹, Ryo Takigawa², Tadatomo Suga¹ (1. Meisei Univ. (Japan), 2. Kyushu Univ. (Japan))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 9:45 AM - 10:00 AM |PDF Download

[K-4-04] Modeling of Redistribution Layers and Through Glass Vias on Glass Interposers

Kai Zhao¹, 〇Haitao He¹, Junchen Dong¹, Yudi Zhao¹ (1. Beijing Information Science and Technology University (China))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 10:00 AM - 10:15 AM |PDF Download

[K-5-01 (Invited)] Hiddenite: CNN Inference Accelerator for Randomly Weighted Neural Networks

〇Jaehoon Yu¹, Kazutoshi Hirose¹, Kota Ando¹, Yasuyuki Okoshi¹, Angel Lopez Garcia-Arias¹, Junnosuke Suzuki¹, Thiem Van Chu¹, Kazushi Kawamura¹, Masato Motomura¹ (1. Tokyo Ins. of Tech. (Japan))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 10:45 AM - 11:15 AM |PDF Download

[K-5-02] A 1.2nJ/Classification 2.4mm² Wired-Logic Neuron Cell Array Using Logically Compressed Non-Linear Function Blocks in 0.18µm CMOS

〇Rei Sumikawa¹, Kota Shiba¹, Atsutake Kosuge¹, Mototsugu Hamada¹, Tadahiro Kuroda¹ (1. Univ. of Tokyo (Japan))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 11:15 AM - 11:30 AM |PDF Download

[K-5-03] Neutron-induced stuck error bits and their recovery in DRAMs on GPU cards

〇Masanori Hashimoto¹, Yangchao Zhang², Kojiro Ito² (1. Kyoto Univ. (Japan), 2. Osaka Univ. (Japan))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 11:30 AM - 11:45 AM |PDF Download