The 71st Divisional Meeting of Division of Colloid and Surface Chemistry

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Slide Presentation » 11. Symposium 3 New Trends in Dispersion-Aggregation Theory toward Developing an Innovative Theory

[SY3] 分散・凝集理論の新潮流－革新モデルの構築をめざして－

[SY3-07] Preparation of Surface Activated Copper Paste for Low Temperature Sintering

*Sakaida Ryota1, Kawasaki Hideya1 (1. Graduate School of Science and Engineering, Kansai University(Japan))

Keywords:Surface activated copper fine particles, Bonding materials, Low temperature sintering

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