The 72nd Divisional Meeting of Division of Colloid and Surface Chemistry

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Regular Session (Poster)

5. Technology of Fine Particles and Colloidal Dispersions

[P089-115] 5. Technology of Fine Particles and Colloidal Dispersions

Fri. Sep 17, 2021 2:00 PM - 4:00 PM Technology and application of fine particles and colloidal dispersions (Poster)

[P109] Silver Nano/Copper Particle Mixed Paste as Low Temperature Bonding Material

*Yusuke Tsudo1, Hideya Kawasaki2 (1. Graduate School of Science and Engineering, Kansai University (Japan), 2. Factory of Chemistry, Materials and Bioengineering (Japan))

Keywords:Silver Nano/Copper Particle Mixed Paste, Low temperature sintering, Adhesion

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