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Symposium(Oral presentation)

Symposium » ・Present and future of CMOS/MEMS integration

[27p-G9-1~5] Present and future of CMOS/MEMS integration

Wed. Mar 27, 2013 1:30 PM - 4:15 PM G9 (B5 2F-2203)

△：Young Scientist Oral Presentation Award Applied
▲：English Presentation
▼：Both Award Applied and English Presentation

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[27p-G9-1] ▲The outlook for integration devices of MEMS and LSI

^○Yasushi Goto¹ (Hitachi, Ltd. Central Research Lab.¹)

[27p-G9-2] ▲Bumpless 3D Interconnects for the Tera-scale Bandwidth and High Density Devices Equivalent to <10nm Node Scaling

^○Takayuki Ohba¹ (The Univ. of Tokyo¹)

[27p-G9-3] ▲Towards Sensors Implementation and Integration Using the CMOS MEMS Platform

Chuanwei Wang¹, Chih-Ming Sun¹, Ming-Han Tsai¹, Yu-Chia Liu¹, ^○Weileun Fang¹ (National Tsing Hua Univ.¹)

[27p-G9-3.1] Break(15min)

[27p-G9-4] ▲System LSI Design and VDEC Activities toward More Than Moore

^○Makoto Ikeda¹ (Univ. of Tokyo¹)

[27p-G9-5] ▲MEMS Design in SPICE Environment

^○Hiroshi Toshiyoshi¹, Toshifumi Konishi², Katsuyuki Machida², Kazuya Masu³ (The Univ. of Tokyo¹, NTT-AT², Tokyo Inst. Tech³)