[C-11-1] Ion-Assisted Low-Temperature Surface Reflow of BPSG for Highly-Reliable Contact Metallization

O. Tatsumi, K. Ino, N. Konishi, Y. Kawai, T. Ohmi (1.Department of Electronic Engineering, Faculty of Engineering, Tohoku University)

1994 International Conference on Solid State Devices and Materials |PDF Download

[C-11-2] Ammonium Salt Added Silica Slurry for Chemical Mechanical Polishing (CMP) of Interlayer Dielectric Film

Y. Hayashi, M. Sakurai, T. Nakajima, K. Hayashi, S. Sasaki, S. Chikaki, T. Kunio (1.Microelectronics Research Laboratories, Microcomputer Division, NEC)

1994 International Conference on Solid State Devices and Materials |PDF Download

[C-11-3] Formation of Copper Interconnects by Reflow of Sputtered Copper Films

Kazuhide Abe, Yusuke Harada, Keiichi Hashimoto, Hiroshi Onoda (1.VLSI Research and Development Center, Oki Electric Industry Co., Ltd.)

1994 International Conference on Solid State Devices and Materials |PDF Download

[C-11-4] Characteristics of the Oxidation Barrier Layers for Copper Metallization

K.-I. Lee, K.-I. Min, S.-K. Joo, K.-G. Rha, W.-S. Kim (1.GoldStar Electron Semi. Lab, 2.Dep. Met'l Eng. Seoul Nat'l Univ)

1994 International Conference on Solid State Devices and Materials |PDF Download

[C-11-5] High Reliability Copper Interconnects through Dry Etching Process

Yasushi Igarashi, Tomomi Yamanobe, Toshio Ito (1.Semiconductor Technology Laboratory, OKI Electric Industry Co., Ltd.)

1994 International Conference on Solid State Devices and Materials |PDF Download

[C-12-1] Selective CVD-Al Contact Plug on Rapid Thermal Processed TiSi2 in NH3 for High Speed CMOS Using Salicide Process

Hiroshi Shinriki, Takayuki Komiya, Nobuyuki Takeyasu, Tomohiro Ohta (1.LSI Research Laboratory, Kawasaki Steel Corp.)

1994 International Conference on Solid State Devices and Materials |PDF Download

[C-12-2] Al Growth on Si(111)(√3x√3)-Ga Surfaces at Room Temperature

Kenzo Maehashi, Hiroyuki Katsuki, Hisao Nakashima (1.The Institute of Scientific and Industrial Research, Osaka University)

1994 International Conference on Solid State Devices and Materials |PDF Download

[C-12-3] Interface Reactions in Al-Alloy/Ti Layered Structures

Tadashi Narita, Keiichi Hashimoto, Yusuke Harada, Hiroshi Onoda (1.VLSI Research and Development Center, Oki Electric Industry Co., Ltd.)

1994 International Conference on Solid State Devices and Materials |PDF Download

[C-12-4] Solid-Phase Reactions in Al Alloy/TiN/Ti/Si Systems Observed by In-Situ Cross-Sectional TEM

S. Sobue, S. Mukainakano, Y. Ueno, T. Hattori (1.Research Laboratories, Nippondenso Co. Ltd.)

1994 International Conference on Solid State Devices and Materials |PDF Download

[C-12-5] Suppression of Al/W Reaction in Al/W Layered Interconnects by W Surface Treatment before Al Deposition

Yusuke Harada, Yuhki Itoh, Hiroshi Onoda (1.VLSI Research and Development Center, OKI Electric Industry Co., Ltd.)

1994 International Conference on Solid State Devices and Materials |PDF Download

340 results (311 - 320)

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