[H-6-1] Cu Alloys and Noble Metal Liner Materials to Extend Damascene Cu Schemes

T. Nogami¹ (1.IBM , USA)

2010 International Conference on Solid State Devices and Materials |PDF Download

[H-6-2] Migration of Copper through Tungsten-Filled Via on Single Damascene Copper Interconnect

B. M. Kim¹, J. J. Kim¹, B. M. Seo¹, J. S. Oh¹, J. Y. Cho¹, J. Lee¹, K. Hong¹, B. H. Choi¹, S. Park¹ (1.Hynix Semiconductor Inc. , Korea)

2010 International Conference on Solid State Devices and Materials |PDF Download

[H-6-3] The Effects of Pre-existing Voids on Electromigration Lifetime Scaling

C. V. Thompson¹ (1.MIT , USA)

2010 International Conference on Solid State Devices and Materials |PDF Download

[H-6-4] Structure Analyses of Ti-Based Self-Formed Barrier Layers

K. Kohama¹, K. Ito¹, Y. Sonobayashi¹, K. Ohmori², K. Mori², K. Maekawa², Y. Shirai¹, M. Murakami³ (1.Kyoto Univ., 2.Renesas Electronics. Corp., 3.The Ritsumeikan Trust , Japan)

2010 International Conference on Solid State Devices and Materials |PDF Download

[H-7-1] 3D Integration Technology and 3D System-on- a Chip

M. Koyanagi¹ (1.Tohoku Univ. , Japan)

2010 International Conference on Solid State Devices and Materials |PDF Download

[H-7-2] Evaluation of Copper Diffusion in Thinned Wafer with Extrinsic Gettering for 3D-LSI by Capacitance-Time(C-t) measurement"

J. C. Bea¹, K. W. Lee¹, M. Murugesan¹, T. Fukushima¹, T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ. , Japan)

2010 International Conference on Solid State Devices and Materials |PDF Download

[H-7-3] Through Silicon Photonic Via with Si core for Low loss and High Density Vertical Optical Interconnection in 3D-LSI

A. Noriki¹, K. W. Lee¹, J. Bea¹, T. Fukushima¹, T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ. , Japan)

2010 International Conference on Solid State Devices and Materials |PDF Download

[H-8-1] Low temperature bonding for 3D integration

T. Suga¹ (1.Univ. of Tokyo , Japan)

2010 International Conference on Solid State Devices and Materials |PDF Download

[H-8-2] Self-Assembly with Metal Microbump-to-Microbump Bonding for Advanced Chip-to-Wafer 3D Integration

E. Iwata¹, Y. Ohara¹, K. W. Lee¹, T. Fukushima¹, T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ. , Japan)

2010 International Conference on Solid State Devices and Materials |PDF Download

[H-8-3] Metal Micro-Bump Induced Stress in 3D-LSIs _a micro-Raman Study

M. Murugesan¹, Y. Ohara¹, J. C. Bea¹, K. W. Lee¹, T. Fukushima¹, T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ. , Japan)

2010 International Conference on Solid State Devices and Materials |PDF Download

655 results (291 - 300)

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