[PS-1-12L] Fabrication of High Performance Single-Crystalline Silicon Thin Film Transistors on a Polyethylene Terephthalate Substrate

K. Sakaike¹, M. Akazawa¹, A. Nakagawa¹, S. Higashi^1,2 (1.Dept. of Semiconductor Electronics and Integration Science, Graduate School of Advanced Sciences of Matter, Hiroshima Univ., 2.Research Inst. for Nanodevice and Bio Systems, Hiroshima Univ. (Japan))

2014 International Conference on Solid State Devices and Materials |PDF Download

[PS-1-13L] Toward 1-nm-EOT Hf_0.5Zr_0.5O₂ Ferroelectric Films

T. Nishimura¹, T. Yajima¹, K. Nagashio¹, A. Toriumi¹ (1.The Univ. of Tokyo (Japan))

2014 International Conference on Solid State Devices and Materials |PDF Download

[PS-1-14L] Si-substrate-based High Mobility Ge-pMOSFETs Using Ozone Passivated Al₂O₃/GeO_x Gate Dielectric

S.K. Wang¹, X. Yang^1,2, Z. Gong¹, R. Liang³, B. Sun¹, W. Zhao¹, H. Chang¹, J. Wang³, H.G. Liu¹ (1.Inst. of Microelectronics of Chinese Academy of Sci., 2.Southeast Univ., 3.Tsinghua Univ. (China))

2014 International Conference on Solid State Devices and Materials |PDF Download

[PS-1-15L] Properties of ultrathin body condensation GOI films thinned by additional thermal oxidation

W.K. Kim^1,2, M. Takenka^1,2, S. Takagi^1,2 (1.The Univ. of Tokyo, 2.JST-CREST (Japan))

2014 International Conference on Solid State Devices and Materials |PDF Download

[PS-2-1] Joule Heating Induced Bonding Interface Improvement and Ti Breakthrough by Electron Bombardment for 40-μm Pitch of Cu TSV and Cu/Sn μ-Bump Pair

Y.J. Chang¹, Y.S. Hsieh¹, C.T. Ko^1,2, W.C. Lo², F.Y. Ouyang³, C.S. Wu⁴, Y.M. Cheng⁴, W.J. Chen⁴, K.N. Chen¹ (1.NCTU, 2.Electronics and Optoelectronics Res. Lab., ITRI, 3.Department of Engineering and System Science, National Hsing Hua Univ., 4.Metal Industries R&D Centre (Taiwan))

2014 International Conference on Solid State Devices and Materials |PDF Download

[PS-2-2] Influence of Lateral Stress on Interdiffusion in Thin Cr/Au Film

J. He¹, X. Huang¹, L. Zhang¹, D. Zhao¹, W. Hu¹, D. Zhang¹ (1.Peking Univ. (China))

2014 International Conference on Solid State Devices and Materials |PDF Download

[PS-2-3] Measurement on Interfacial Adhesion Property of Low-k Thin Film by the Surface Acoustic Waves Using the Cohesion Zone Model

X. Xiao¹, Y. Tao¹, T. Kikkawa² (1.Univ. of Tianjin, 2.Hiroshima Univ. (China))

2014 International Conference on Solid State Devices and Materials |PDF Download

[PS-2-4L] Vacuum Ultraviolet (VUV) / Vapor-Assisted Bonding for Organic / Inorganic Hybrid Integration

A. Shigetou¹, M. Ajayan^1,2, J. Mizuno², S. Shuichi² (1.National Inst. for Mater. Sci., 2.Waseda Univ. (Japan))

2014 International Conference on Solid State Devices and Materials |PDF Download

[PS-3-1] Extraction of Source/Drain Series Resistance Components Optimized for Double-gate FinFETs.

J.–S. Yoon¹, E.–Y. Jeong¹, S.–H. Lee¹, Y.–R. Kim¹, J.–H. Hong¹, J.–S. Lee¹, Y.–H. Jeong¹ (1.Pohang Univ. of Sci. and Tech. (Korea))

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[PS-3-2] Impact of Surface Oxide Layer on Band Structure Modulation in Si Quantum Well Structures

T. Mizuno¹, Y. Suzuki¹, M. Yamanaka¹, Y. Nagamine¹, Y. Nakahara¹, Y. Nagata¹, T. Aoki¹, T. Maeda² (1.Kanagawa Univ., 2.AIST (Japan))

2014 International Conference on Solid State Devices and Materials |PDF Download