MMIJ & EARTH 2017, Sapporo

Presentation information (2017/08/24 Ver.)

Special Session

Fundamental and Application of Powder Processing

Tue. Sep 26, 2017 9:30 AM - 11:50 AM C212 (Fl.2.,Build. C)

Chairman: Chiharu Tokoro (Waseda University), Atsushi Shibayama (Akita University)

10:50 AM - 11:20 AM

[1501-04-03] Synthesis of copper nanoparticles for inkjet printing technology by surfactant-assisted chemical reduction method with D-glucose

○Giuseppe Granata1, Chiharu Tokoro1 (1. Waseda University)

Chairman: Atsushi Shibayama (Akita University)

Keywords:copper nanoparticles, glucose, inkjet printing technology, ANOVA

In this work, aiming to produce a copper-based electronic material to be used in inkjet printing technology, we studied the synthesis of copper nanoparticles (CuNPs) by surfactant-assisted chemical reduction method.
In order to achieve particle size control and stability towards oxidation, the use of three different surfactants (CTAB, SDS, PVP) and two reducing agents (D-glucose, hydrazine) at two levels of concentrations was thoroughly investigated by a factorial design of experiments with statistical analysis of data. The significant effects of the investigated factors on the final particle size of CuNPs was assessed by analysis of variance.
The produced CuNPs were characterized by XRD, UV-Vis spectrophotometry and TGA-DTA to determine phase composition, stability towards oxidation and sintering temperature of the obtained products while the particle size distribution was determined by image analysis of FE-SEM micrographs.
Under the investigated conditions, CTAB was found capable of preventing oxidation but it had a significant positive effect on nanoparticle size (about 4 nm and 3 nm); SDS determined a good size control but no stabilization, whilst PVP could provide both size control (significant negative effect of about 15 nm and 25 nm) and stability. Average size of CuNPs can be significantly reduced of about 5 nm by replacing D-glucose with hydrazine.
Upon identifications of the best operating conditions in terms of surfactant and reducing agent, aiming to a future massive production, we investigated the same synthesis from highly concentrated copper solutions (.25-1 M) and we performed an optimization of other operating parameters such as the stirring speed and the mixing rate of copper precursor and reducing agent solutions.
Among the obtained products, the most suitable in terms of particle size distribution and sintering temperature were printed to determine the specific electric resistivity.

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