15:30 〜 17:30
[PE1-069] LED thermal fluid modeling to increase cooling efficiency at the different thermal conductivity of heat sink and thermal contact resistance of TIM.
キーワード：LED, TIM, Cooling efficiency, simulation
The structure of the LED is composed of Epoxy, Al, heat sink. During these, the most important factors in determining the efficiency of LED are heat sinks and TIM.
The heat sink is mostly made of Al series in the market. However, in order to improve the heat dissipation characteristics of LED, the focus is on improving the efficiency of LED by changing the thermal conductivity characteristics of the heat sinks using Al/ cu instead of Al heat material. It acts to reduce the thermal resistance that may occur when a TIM is placed between the heat-dissipating material and the LED.
However, the cooling efficiency of the LED changes depending on what the TIM material is used.
So, we calculated the cooling effieciency of LED according to this TIM material through computer simulation.
Ansys-CFX was used to calculate the cooling efficiency of the LED according to Al/Cu conversion and TIM thermal resistance. The computational simulation was performed by giving the variables of the output of the LED, the surface area of the heat sink, and the thermal conductivity.
The heat sink is mostly made of Al series in the market. However, in order to improve the heat dissipation characteristics of LED, the focus is on improving the efficiency of LED by changing the thermal conductivity characteristics of the heat sinks using Al/ cu instead of Al heat material. It acts to reduce the thermal resistance that may occur when a TIM is placed between the heat-dissipating material and the LED.
However, the cooling efficiency of the LED changes depending on what the TIM material is used.
So, we calculated the cooling effieciency of LED according to this TIM material through computer simulation.
Ansys-CFX was used to calculate the cooling efficiency of the LED according to Al/Cu conversion and TIM thermal resistance. The computational simulation was performed by giving the variables of the output of the LED, the surface area of the heat sink, and the thermal conductivity.
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