[E-15-2] On-chip Clock Distribution Using Transmission Line

Masakazu Yamashina, Masayuki Mizuno (1.Silicon-Systems Research Laboratories, NEC Corporation)

1999 International Conference on Solid State Devices and Materials |PDF Download

[E-15-3] Development of the Three-Dimensional Integration Technology for Highly Parallel Image Processing Chip

K. W. Lee, T. Nakamura, H. Hashimoto, K. Sakuma, K. T. Park, N. Miyakawa, H. Itani, H. Kurino, M. Koyanagi (1.Dept. of Machine Intelligence and System Engineering, Tohoku University, 2.Fuji Xerox Co., 3.Mitsubishi Heavy Industry Co.)

1999 International Conference on Solid State Devices and Materials |PDF Download

[E-15-4] Reduction of System Power Consumption and High-Speed Transmission Characteristics by High-Speed, Low-Amplitude Interface

Ryuzo Yokoyama, Masao Sasajima, Yuhiko Fujiwara, Susumu Yamada (1.Central Office Switching Systems Division and Transmission Systems Division, Oki Electric Industry Co., Ltd.)

1999 International Conference on Solid State Devices and Materials |PDF Download

[E-16-1] Organic Substrate and Flip-Chip Bonding on It Technology, "Chip on ALIVH" Suitable for GHz System Packaging

Yutaka Taguchi, Hideki Iwaki, Minehiro Itagaki, Yoshihiro Bessho, Kazuo Eda (1.Matsushita Electric Industrial Co., Ltd., Device Engineering Development Center)

1999 International Conference on Solid State Devices and Materials |PDF Download

[E-16-2] High Spatial Resolution Magnetic Field Measurements Using Thin-Film Shielded Loop Coil

M. Yamaguchi, S. Yabukami, H. Yurugi, K. I. Arai, N. Masuda, N. Tamaki, H. Tohya (1.Research Institute of Electrical Communication, Tohoku Univ., 2.EMC Engineering Center, NEC Co.)

1999 International Conference on Solid State Devices and Materials |PDF Download

[E-16-3] Measurement of Dynamic Strain during Ultrasonic Au-Bumping on Si Chip

Masafumi Hizukuri, Tanemasa Asano (1.Center for Microelectronic Systems, Kyushu Institute of Technology)

1999 International Conference on Solid State Devices and Materials |PDF Download

[E-16-4] A Wafer-Level Burn-in Technology-Realization of Stable Contact Resistance for Al Bond Pads-

Yoshiro Nakata, Keiichi Fujimoto, Shinichi Oki, Akio Watakabe (1.ULSI Process Technology Development Center, Semiconductor Company Matsushita Electronics Corporation)

1999 International Conference on Solid State Devices and Materials |PDF Download

297 results (291 - 297)

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