[P-2-8] Anisotropic mechanical characterization of Cu single crystals and thin films

Satoshi Shimizu, Nobuo Kojima, Jiping Ye (1.Research Department, NISSAN ARC, LTD.)

2006 International Conference on Solid State Devices and Materials |PDF Download

[P-2-9] Ag diffusion in Low-K material (SiOC and BCN) and its challenges using as an interconnection

M. K. Mazumder, R. Moriyama, C. Kimura, H. Aoki, T. Sugino (1.Dept. of Electrical, Electronic and Information Engineering, Osaka University)

2006 International Conference on Solid State Devices and Materials |PDF Download

[P-2-10] Relationship between structure and conductance of nanometer-sized iridium contacts

Minoru Ryu, Tokushi Kizuka (1.Institute of Materials Science, University of Tsukuba, 2.Special Research Project of Nanoscience, University of Tsukuba, 3.Precursory Research for Embryonic Science and Technology, JST)

2006 International Conference on Solid State Devices and Materials |PDF Download

[P-2-11] Effectiveness of Titanium and Carbon capping layer in NiSi formation with Ni film deposited by Atomic Layer Deposition

C. M. Yang, S. W Yun, J. B. Ha, K. I. Na, H. I. Cho, H. B. Lee, J. H. Jeong, S. H. Hahm, S. H. Kong, J. H. Lee (1.School of Electrical Engineering and Computer Science, Kyungpook National University)

2006 International Conference on Solid State Devices and Materials |PDF Download

[P-2-12] A Study of Relationship of Wafer Breakage vs. Wafer Edge Analysis

Sheng-Hsiung Chen, Shen-Li Chen, Wen-Kuan Yeh (1.Department of Electrical Engineer, Tung Fang Institute of Technology, 2.Department of Electronic Engineering, National United University, 3.Department of Electrical Engineering, National University of Kaohsiung)

2006 International Conference on Solid State Devices and Materials |PDF Download

[P-2-13] Characterization of Void in Bonded SOI Wafers by Controlling Coherence Length of Near-Infrared Microscope

Noritaka Ajari, Junichi Uchikoshi, Takaaki Hirokane, Kennta Arima, Mizuho Morita (1.Department of Precision Science and Technology, Graduate School of Engineering, Osaka University)

2006 International Conference on Solid State Devices and Materials |PDF Download

[P-2-14] Evaluation of Alignment Accuracy for Wafer Bonding Using Moire Technique

Chenxi Wang, Tadatomo Suga (1.Department of Precision Engineering, School of Engineering, The University of Tokyo)

2006 International Conference on Solid State Devices and Materials |PDF Download

[P-2-15] Sub-Atmospheric Chemical Vapor Deposition Process for Chip-to-Wafer 3-Dimensional Integration

Hirokazu Kikuchi, Yusuke Yamada, Atif Mossad Ali, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (1.Dept. of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University)

2006 International Conference on Solid State Devices and Materials |PDF Download

[P-2-16] A Low Temperature Process of Bonding Fine Pitch Au/Sn Bumps in Air

Ying-Hui Wang, Kenji Nishida, Matthias Hutter, Takashi Kimura, Tadatomo Suga (1.The Univ. of Tokyo, Dept. of Precision Eng. School of Eng., 2.Materials Analysis Station, National Institute for Materials Science, 3.Fraunhofer IZM)

2006 International Conference on Solid State Devices and Materials |PDF Download

[P-2-17] Finite element analysis of nanometer-scale contact for low temperature bonding

Tasuku Higashino, Tadatomo Suga (1.University of Tokyo, Department of Precision Engineering, School of Engineering)

2006 International Conference on Solid State Devices and Materials |PDF Download

566 results (401 - 410)

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