[G-4-2] Novel Sensor Circuits Design Using Multi-physics Simulation for CMOS-MEMS Technology

T. Konishi¹、D. Yamane²、T. Matsushima¹、S. Maruyama³、K. Kagaya²、H. Ito²、N. Ishihara²、H. Toshiyoshi³、K. Machida^1,2、K. Masu² (1.NTT Advanced Tech. Corp.、2.Tokyo Tech.、3.Univ. of Tokyo (Japan))

2013 International Conference on Solid State Devices and Materials |PDF ダウンロード

[G-4-3] Amperometric Electrochemical Sensor Array for On-Chip Simultaneous Imaging

T. Kuno¹、K. Niitsu¹、K. Nakazato¹ (1.Univ. of Nagoya (Japan))

2013 International Conference on Solid State Devices and Materials |PDF ダウンロード

[G-4-4] A CMOS Image Sensor Having Stacked Photodiodes for Lensless Observation System of Digital Enzyme-linked Immunosorbent Assay (ELISA)

H. Takehara¹、K. Miyazawa¹、T. Noda^1,3、K. Sasagawa^1,3、T. Tokuda^1,3、S.H. Kim^2,3、R. Iino^2,3、H. Noji^2,3、J. Ohta^1,3 (1.Nara Inst. of Sci. and Tech.、2.Univ. of Tokyo、3.JST-CREST (Japan))

2013 International Conference on Solid State Devices and Materials |PDF ダウンロード

[G-6-1] BEOL-Transistor Technology with InGaZnO channel for High/Low Voltage Bridging I/Os

K. Kaneko¹、N. Inoue¹、H. Sunamura¹、S. Saito¹、N. Furutake¹、M. Narihiro¹、J. Kawahara¹、M. Hane¹、Y. Hayashi¹ (1.Renesas Electronics Corp. (Japan))

2013 International Conference on Solid State Devices and Materials |PDF ダウンロード

[G-6-2] Impact of Plasma Nitridation on Reliability Performance of MIM Capacitors Based on ZrLaO_x/ZrTiO_x/ZrLaO_x Laminate Insulator

C.C. Lin¹、R.S. Jiang¹、Y.B. Lin¹、M.T. Yu¹、C.E. Sun¹、Y.H. Wu¹ (1.National Tsing Hua Univ. (Taiwan))

2013 International Conference on Solid State Devices and Materials |PDF ダウンロード

[G-6-3] Polarity Dependence on Electrical Properties of Low-k Dielectric in Copper Interconnect Structures

M. Lin¹、J. Liang¹、A. Juan¹、K.C. Su¹ (1.United Microelectronics Corp. (Taiwan))

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[G-6-4] Ultra Low-k Non-Porous SiOCH Film (k < 2.2) Formed by Ultra Precise Molecular Control in Polymerization Synthesis by Using Large-Radius Neutral- Beam-Enhanced CVD

Y. Kikuchi^1,3、S. Samukawa^1,2 (1.Tohoku Univ.、2.WPI-AIMR, Tohoku Univ.、3.Tokyo Electron Limited (Japan))

2013 International Conference on Solid State Devices and Materials |PDF ダウンロード

[G-6-5] Low-k Mesoporous Pure Silica Zeolite Synthesis with Centrifugation Process of Zeolite Precursor

T. Sato¹、S. Kuroki¹、Y. Kayaba²、T. Kikkawa¹ (1.Hiroshima Univ.、2.Mitsui Chemicals, Inc. (Japan))

2013 International Conference on Solid State Devices and Materials |PDF ダウンロード

[G-7-1] 3D Heterogeneous Integration for Nanosensor Systems – the EU-Project e-BRAINS

M. Fernández–Bolaños¹、P. Ramm²、R. Pufall³、E. Buitrago¹、C. Zilch⁴、H. Guerin¹、H. Le Poche⁵、R. Pohle⁶、A. Popescu⁶、A.M. Ionescu¹ (1.École Polytechnique Fédérale de Lausanne (EPFL)、2.Fraunhofer Research Institution for Modular Solid State Technologies EMFT、3.Infineon Technologies AG、4.Magna Diagnostics GmbH、5.LITEN⁄DTNM⁄LCH, Commissariat à l'énergie atomique et aux énergies alternatives、6.SIEMENS AG Corporate Research Munich (Switzerland))

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[G-7-2] Local Bending Stress Reduction with Room-Temperature Curing Adhesive for Decrease in Keep-out-Zone (KOZ) of 3D IC

H. Kino¹、T. Fukushima¹、K.W. Lee¹、M. Koyanagi¹、T. Tanaka¹ (1.Tohoku Univ. (Japan))

2013 International Conference on Solid State Devices and Materials |PDF ダウンロード