2015 International Conference on Solid State Devices and Materials

2015年9月27日〜 2015年9月30日
Sapporo Convention Center, Sapporo, Japan

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894件中(641 - 650)

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[PS-1-19L] Investigation and Comparison of Quantum-Capacitance Induced Inversion-Charge Loss for Ultra-Thin-Body and Double-Gate III-V n-MOSFETs

^○S. L. Shen¹, H. H. Shen¹, C. H. Yu¹, P. Su¹ (1.National Chiao Tung Univ.(Taiwan))

2015 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-1-20L] New Structural Properties of Ferroelectric Y₂O₃-doped HfO₂ Films Probed by Microscopic Raman Spectroscopy Measurements

^○K. Izukashi^1,2, T. Nishimura^1,2, S. Migita^2,3, A. Toriumi^1,2 (1.Univ. of Tokyo, 2.AIST, 3.JST-CREST(Japan))

2015 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-1] Mechanical Properties of Electrodeposited Gold for MEMS Device

^○M. Yoshiba^1,2, C. Y. Chen^1,2, T. F. M. Chang^1,2, D. Yamane^1,2, K. Machida^1,2,3, K. Masu^1,2, M. Sone^1,2 (1.Tokyo Tech, 2.JST-CREST, 3.NTT Adv. Tech. Corp.(Japan))

2015 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-2] Proposal of a Simple MEMS Phase Shifter Based on Effective Dielectric Constant Modulation

^○D. Nakano¹, M. Mori¹, K. Maezawa¹, H. Ishii², H. Ando³ (1.Univ. of Toyama, 2.Toyohashi Univ. of Tech., 3.National Inst. of Tech., Toyota College(Japan))

2015 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-3] Study on Ti/Au Two-Layered Cantilevers with Different Aspect Ratio for MEMS Devices

^○M. Teranishi^1,2, T. F. M. Chang^1,2, C. Y. Chen^1,2, T. Konishi³, K. Machida^1,2,3, H. Toshiyoshi^1,4, D. Yamane^1,2, K. Masu^1,2, M. Sone^1,2 (1.JST-CREST, 2.Tokyo Tech, 3.NTT Adv. Tech. Corp., 4.Univ. of Tokyo(Japan))

2015 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-4] Micro-Texture Dependence of the Strength of Electroplated Copper Fine Bumps Used for 3-Dimensonal Integration

^○M. Gotoh¹, K. Suzuki¹, H. Miura¹ (1.Tohoku Univ.(Japan))

2015 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-5] Local Stress Effect Due to Operation-Heating-Induced Adhesive Expansion on Transistor Performances in 3D IC

^○H. Kino¹, H. Hashiguchi¹, S. Tanikawa¹, Y. Sugawara¹, S. Ikegaya¹, T. Fukusima¹, M. Koyanagi¹, T. Tanaka¹ (1.Tohoku Univ.(Japan))

2015 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-6] Combined Surface-Activated Bonding Technique for Low-Temperature Hydrophilic Wafer Bonding with Interfacial Water Management

^○R. He¹, M. Fujino¹, A. Yamauchi², T. Suga¹ (1.Univ. of Tokyo, 2.Bondtech Co., Ltd.(Japan))

2015 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-7] Transient Liquid-Phase Sintering using Tin and Silver Powder Mixture for Die Bonding

^○M. Fujino¹, H. Narusawa¹, Y. Kuramochi¹, E. Higurashi¹, T. Suga¹, T. Shiratori², M. Mizukoshi³ (1.Univ. of Tokyo, 2.ALPHA DESIGN CO., LTD., 3.SYNDEO(Japan))

2015 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-8] A Novel Hybrid Strategy of via-first Bare TSVs for Enhanced Signal Integrity in 3-D Integrated Systems

^○R. Fang¹, X. Sun¹, M. Miao², Y. Jin¹ (1.Peking Univ., 2.Beijing Information Sci.&Tech. Univ.(China))

2015 International Conference on Solid State Devices and Materials |PDF ダウンロード

894件中(641 - 650)

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