The Japan Society of Applied Physics

419件中(361 - 370)

[K-1-01] Simulation and Experimental Study of Stretchable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging

〇CHANG LIU1, Yuki Susumago1, Tadaaki Hoshi1, Hisashi Kino2, Tetsu Tanaka1,2, Takafumi Fukushima1,2 (1. Graduate School of Eng., Tohoku Univ. (Japan), 2. Graduate School of Biomed. Eng., Tohoku Univ. (Japan))

2022 International Conference on Solid State Devices and Materials |2022年9月27日(火) 11:30 〜 11:45 |PDF ダウンロード

[K-1-03] Fabrication of the 3D-stacked retinal prosthesis chip to realize high-performance retinal prosthesis

〇Aoba Onishi1, Ryotaro Bamba1, Bungo Tanaka1, Ryouhei Kishimoto2, Hisashi Kino1, Takafumi Fukushima1,2, Tetsu Tanaka1,2 (1. Dep. of Biomed. Eng., Graduate School of Biomed. Eng., Tohoku Univ. (Japan), 2. Dep. of Mech. Sys. Eng., Graduate School of Eng., Tohoku Univ. (Japan))

2022 International Conference on Solid State Devices and Materials |2022年9月27日(火) 12:00 〜 12:15 |PDF ダウンロード

[K-2-05 (Late News)] A Z-gate Layout MOSFET Design and Verification of Radiation Hardness against γ-ray Total Ionizing Dose Effect

〇Kaito Kuroki1, Arisa Kimura1, Kenji Hirakawa2, Masayuki Iwase2, Munehiro Ogasawara2, Takashi Yoda2, Noboru Ishihara1,2, Hiroyuki Ito1,2 (1. Nano Sensing Unit, Inst. of Innovative Res. , Tokyo Inst. of Tech. (Japan), 2. Lab. for Future Interdisciplinary Res. of Sci. and Tech. , Tokyo Inst. of Tech. (Japan))

2022 International Conference on Solid State Devices and Materials |2022年9月27日(火) 15:00 〜 15:15 |PDF ダウンロード

419件中(361 - 370)