[K-5-04] Design of an Energy-Efficient Nonvolatile Lookup Table Circuit Using Active-Load-Localized Circuitry with Self-Terminated Writing/Reading

〇Daisuke Suzuki¹, Takahiro Hanyu² (1. The University of Aizu (Japan), 2. Tohoku University (Japan))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 11:45 AM - 12:00 PM |PDF Download

[K-6-01 (Invited)] Further Scaling Challenges and Opportunities

〇Takashi Hayakawa¹ (1. TEL (Japan))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 1:30 PM - 2:00 PM |PDF Download

[K-6-02] Evaluating Sintered Silver Die-attach Thermal Cycling Degradation
by Nine Point Cycling Bending Test

〇Keisuke Wakamoto^1,2, Takukazu Otsuka¹, Ken Nakahara¹, Takahiro Namazu² (1. Rohm Co., Ltd (Japan), 2. Kyoto University of Advanced Science (Japan))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 2:00 PM - 2:15 PM |PDF Download

[K-6-03] Concentration Monitoring of H₂O₂ Based Slurry for Metal Chemical Mechanical Planarization (CMP) using Raman Spectroscopy

〇Jinhyun Choe¹, Jinseok Kim¹, Dawon Ahn¹, Eunsu Jung¹, Sunggyu Pyo¹ (1. Chung-Ang University (Korea))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 2:15 PM - 2:30 PM |PDF Download

[K-6-04 (Late News)] Growth of SiC Thin Film on Various Metal Substrates by CVD Using Vinylsilane

〇Koki Ono¹, Takashi Koide¹, Yong Jin², Yuuki Tsutiizu¹, Takuhiro Hasegawa¹, Shigeo Yasuhara², Wakana Takeuchi¹ (1. Aichi Institute Technology (Japan), 2. Japan Advanced Chemicals Ltd. (Japan))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 2:30 PM - 2:45 PM |PDF Download

[K-6-05 (Late News)] Evaluation of Reactive Sputtered Ti-group MAX Alloy for Wiring Material

〇Takeyasu Saito¹, Kazunobu WAKAMATSU¹, Kazuki UEDA¹, Naoki OKAMOTO¹ (1. Osaka Metropolitan Univ. (Japan))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 2:45 PM - 3:00 PM |PDF Download

[K-6-06] 18nm pitch EUVL Line/Space double-patterning exploration for N3 BEOL

〇Stephane LARIVIERE¹, Stefan DECOSTER¹, Sara PAOLILLO¹, Vincent RENAUD¹, Diana TSVETANOVA¹, Bart KENENS¹, Hanne DE COSTER¹, Quoc Toan LE¹, Yusuke ONIKI¹, Alfonso SEPULVEDA MARQUEZ¹, Karen STIERS¹, Felix SEIDEL¹, Martin O'TOOLE¹, Mircea DUSA¹, Kurt RONSE¹, Chris WILSON¹ (1. imec (Belgium))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 3:00 PM - 3:15 PM |PDF Download

[K-6-07] Demonstrating 1T1R Memory Cell by Heterogeneous Integration of Zinc Oxide Thin-Film Transistor with SiC-based Memristor

〇Ben Daniel Rowlinson¹, Omesh Kapur¹, Dongkai Guo¹, Ruomeng Huang¹, C.H. de Groot¹, Harold Chong¹ (1. University of Southampton (UK))

2022 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2022 3:15 PM - 3:30 PM |PDF Download

[K-7-01 (Invited)] Mixed-Signal Circuit Design for the Data-Driven World

〇Boris Murmann¹ (1. Stanford Univ. (United States of America))

2022 International Conference on Solid State Devices and Materials |Thu. Sep 29, 2022 9:00 AM - 9:30 AM |PDF Download

[K-7-02] Crystalline Oxide Semiconductor FET-based Analog Neural Network for Intelligent IoT Sensor

〇Hidefumi Rikimaru¹, Satoru Ohshita¹, Yoshiyuki Kurokawa¹, Toshihiko Takeuchi¹, Shunpei Yamazaki¹ (1. Semiconductor Energy Laboratory Co., Ltd. (Japan))

2022 International Conference on Solid State Devices and Materials |Thu. Sep 29, 2022 9:30 AM - 9:45 AM |PDF Download