[C-1-1] Low-Voltage Operated Piezoelectric Tunable Capacitor for Reconfigurable RF Systems

Takashi Kawakubo, Toshihiko Nagano, Michihiko Nishigaki, Kazuhiko Itaya (1.Toshiba Research Consulting Corporation, 2.Toshiba Corporation, Corporate Research and Development Center)

2006 International Conference on Solid State Devices and Materials |PDF Download

[C-1-2] MEMS Packaging for RF switch

Tomonori Seki (1.Advanced Device Laboratory, OMRON Corporation)

2006 International Conference on Solid State Devices and Materials |PDF Download

[C-1-3] A Capacitive-Sensing Scheme for Control of Adaptive MEMS Device Stacked on CMOS LSI

T. Shimamura, H. Morimura, K. Kuwabara, N. Sato, J. Terada, M. Ugajin, S. Shigematsu, K. Machida, M. Nakanishi, H. Ishii (1.NTT Microsystem Integration Laboratories, 2.NTT Advanced Technology Corporation)

2006 International Conference on Solid State Devices and Materials |PDF Download

[C-1-4] Equivalent Circuit Model for On-Chip Variable Inductor

Tackya Yammouch, Koichi Ishida, Kenichi Okada, Kazuya Masu (1.Integrated Research Institute, Tokyo Institute of Technology)

2006 International Conference on Solid State Devices and Materials |PDF Download

[C-1-5] On-Chip Asymmetric Coaxial Waveguide Structure for Chip Area Reduction

Ivan C. H. Lai, Hideyuki Tanimoto, Minoru Fujishima (1.School of Frontier Sciences, The University of Tokyo)

2006 International Conference on Solid State Devices and Materials |PDF Download

[C-1-6] On-Die Monitoring of Substrate Coupling for Mixed-Signal Circuit Isolation

Daisuke Kosaka, Masaki Fujiwara, Takumi Danjo, Makoto Nagata (1.Department of Computer and Systems Engineering, Kobe University)

2006 International Conference on Solid State Devices and Materials |PDF Download

[C-2-1] 60% Power Reduction in Inductive-Coupling Inter-Chip Link by Current-Sensing Technique

Kiichi Niitsu, Noriyuki Miura, Mari Inoue, Yoshihiro Nakagawa, Masamoto Tago, Muneo Fukaishi, Hiroki Ishikuro, Tadahiro Kuroda (1.Keio University, Department of Electronics and Electrical Engineering, 2.NEC Corporation)

2006 International Conference on Solid State Devices and Materials |PDF Download

[C-2-2] Inter-chip Transmission Characteristics of Meander Dipole Antennas Integrated in 0.18 μm CMOS UWB Transceiver Chips

K. Kimoto, N. Sasaki, M. Nitta, M. Fukuda, T. Kikkawa (1.Research Center for Nanodevices and Systems, Hiroshima University)

2006 International Conference on Solid State Devices and Materials |PDF Download

[C-2-3] On-Chip Yagi Antenna for Wireless Signal Transmission in Stacked MCP

Kazuma Ohashi, Tackya Yammouch, Makoto Kimura, Hiroyuki Ito, Kenichi Okada, Koichi Ishida, Kazuhisa Itoi, Masakazu Sato, Tatsuya Ito, Kazuya Masu (1.Integrated Research Institute, Tokyo Institute of Technology, 2.Electron Device Laboratory, Fujikura Ltd.)

2006 International Conference on Solid State Devices and Materials |PDF Download

[C-2-4] A Single-chip Ultra-Wideband Receiver using Silicon Integrated Antennas for Inter-chip Wireless Interconnection

N. Sasaki, M. Fukuda, M. Nitta, K. Kimoto, T. Kikkawa (1.Research Center for Nanodevices and Systems, Hiroshima University)

2006 International Conference on Solid State Devices and Materials |PDF Download

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