[C-5-1] Through Silicon Via (TSV) Fabrication with Low-k Dielectric Liner and Its Implications on Parasitic Capacitance and Leakage Current

L. Zhang^1,2, H. Y. Li¹, S. Gao¹, C. S. Tan² (1.A*STAR, 2.Nanyang Technological University , Singapore)

2011 International Conference on Solid State Devices and Materials |PDF Download

[C-5-2] Impacts of Microbump-Induced Local Bending Stress in 3D-LSI

H. Kino¹, M. Murugesan¹, K. W. Lee¹, J. C. Bea¹, C. Miyazaki², H. Kobayashi², H. Shimamoto², T. Fukushima¹, T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ., 2.ASET , Japan)

2011 International Conference on Solid State Devices and Materials |PDF Download

[C-5-3] Room-Temperature Bonding of LSI Chips on PEN Film Using Mechanical Caulking of Au Cone Bump

T. Shuto¹, N. Watanabe¹, A. Ikeda¹, T. Asano¹ (1.Kyushu Univ. , Japan)

2011 International Conference on Solid State Devices and Materials |PDF Download

[C-5-4] 3D Chip Stacking of RF Devices with Cu TSV, Cu/Sn Bumps and Sealing Ring

W. Zhang¹, B. Majeed¹, X. Sun¹, G. Posada¹, C. Diekmann², C. Eggs², E. Schmidhammer², W. De Raedt¹ (1.IMEC , Belgium, 2.EPCOS AG , Germany)

2011 International Conference on Solid State Devices and Materials |PDF Download

[C-8-1] Low temperature curable nano-inks for printed wiring and transparent films

K. Suganuma¹, M. Nogi¹, T. Tokuno¹, J. Jiu¹ (1.Osaka Univ. , Japan)

2011 International Conference on Solid State Devices and Materials |PDF Download

[C-8-2] Stress from Tungsten-Filled TSVs Measured by Raman Spectroscopy on Cross-Sectional Samples

J. Gambino¹, D. Vanslette¹, B. Webb¹, C. Luce¹, G. Chrisman¹, T. Ueda², T. Ishigaki², K. Kang², W. S. Yoo² (1.IBM, 2.WaferMasters, Inc. , USA)

2011 International Conference on Solid State Devices and Materials |PDF Download

[C-8-3] Evaluation of Thermo-Mechanical Stress Induced by W-TSVs in 3D-LSI with W/Cu Hybrid TSVs

H. Hashiguchi¹, M. Murugesan¹, J. C. Bea¹, K. W. Lee¹, T. Fukushima¹, H. Kobayashi², T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ., 2.Association of Super-Advanced Electronics Tech. , Japan)

2011 International Conference on Solid State Devices and Materials |PDF Download

[C-8-4] Size and Deformation Mode Dependencies on the Strength of Dry-Etched Single Crystal Silicon Micro-Beams

T. Namazu^1,2, H. Yamagiwa¹, T. Fujii¹, M. Saito³, K. Yamada³, T. Miyatake³ (1.Univ. of Hyogo, 2.PRESTO-JST, 3.Panasonic Electric Works Co., Ltd. , Japan)

2011 International Conference on Solid State Devices and Materials |PDF Download

[C-8-5] Local Interface Strength Evaluation for LSI Interconnect with Micron Resolution

N. Shishido^1,5, C. Chen¹, H. Sato^1,5, S. Kamiya^1,5, M. Nishida^1,5, M. Omiya^2,5, T. Nokuo^3,5, T. Nagasawa^3,5, T. Suzuki⁴, T. Nakamura⁴ (1.Nagoya Inst. of Tech., 2.Keio Univ., 3.JEOL Ltd., 4.Fujitsu Labs Ltd., 5.CREST-JST , Japan)

2011 International Conference on Solid State Devices and Materials |PDF Download

[C-9-1] In Situ Analysis of Plasma-Induced Modification on Porous SiOCH Films

H. Yamamoto¹, K. Asano¹, K. Ishikawa¹, K. Takeda¹, H. Kondo¹, M. Sekine¹, M. Hori¹ (1.Nagoya Univ. , Japan)

2011 International Conference on Solid State Devices and Materials |PDF Download

741 results (111 - 120)

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