The Japan Society of Applied Physics

763 results (191 - 200)

[H-3-02] Enhancement of Direct Cu Bonding via Pulsed Flash Light

J. -M. Song1, S. -Y. Liang1, P. -H. Chiang1, S. -K. Huang2, Y. -T. Chiu2, D. Tarng2, C. -P. Hung2 (1.National Chung Hsing Univ. (Taiwan), 2.Advanced Semiconductor Engineering Group (Taiwan))

2017 International Conference on Solid State Devices and Materials |Thu. Sep 21, 2017 10:00 AM - 10:20 AM |PDF Download

763 results (191 - 200)