[C-6-04 (Late News)] Micro Channel Based Heat Sink with Integrated Thin-Film Temperature Sensors

^○J. Wang¹, T. Wang¹, J. He¹, Y. Yang¹, Y. Li¹, H. Jiao¹, C. Wu¹, W. Luo¹, Y. Shuai¹, W. Zhang¹ (1.Univ. of Electronic Sci. and Tech. of China (China))

2017 International Conference on Solid State Devices and Materials |Fri. Sep 22, 2017 12:15 PM - 12:30 PM |PDF Download

[C-7-01] Telecom-Wavelength Quantum Relay using a Semiconductor Entangled Light Source

J. Huwer¹, M. Felle^1,2,^○M. Stevenson¹, J. Skiba-Szymanska¹, M. Ward¹, I. Farrer², R. Penty², D. Ritchie², A. Shields¹ (1.Toshiba Research Europe Ltd. (UK), 2.Univ. of Cambridge (UK))

2017 International Conference on Solid State Devices and Materials |Fri. Sep 22, 2017 1:40 PM - 1:55 PM |PDF Download

[C-7-02] Generation and Detection of Edge Magnetoplasmons in a Quantum Hall Edge Channel Using a Photoconductive Switch

^○C. Lin¹, K. Morita¹, K. Muraki², T. Fujisawa¹ (1.Tokyo Tech (Japan), 2.NTT Basic Res. Labs. (Japan))

2017 International Conference on Solid State Devices and Materials |Fri. Sep 22, 2017 1:55 PM - 2:10 PM |PDF Download

[C-7-03] Electrically Tunable Coupling of a Ge/Si Core/Shell Nanowire Double Quantum to a Superconducting Transmission Line Cavity

^○R. Wang¹, R. S. Deacon^1,2, J. Yao³, C. M. Lieber³, K. Ishibashi^1,2 (1.RIKEN (Japan), 2.CEMS, RIKEN (Japan), 3.Harvard Univ. (USA))

2017 International Conference on Solid State Devices and Materials |Fri. Sep 22, 2017 2:10 PM - 2:25 PM |PDF Download

[C-7-04] Terahertz response in the quantum Hall effect regime of a quantum-well based charge sensitive phototransistor

D. Nakagawa¹, K. Takizawa¹,^○K. Ikushima¹, S. Kim², M. Patrashin³, I. Hosako³, S. Komiyama² (1.Tokyo Univ. of Agri. & Tech. (Japan), 2.Univ. of Tokyo (Japan), 3.NICT (Japan))

2017 International Conference on Solid State Devices and Materials |Fri. Sep 22, 2017 2:25 PM - 2:40 PM |PDF Download

[C-7-05] Acoustic characteristics of a surface-acoustic-wave resonator made of two Bragg reflectors with periodic metallization of GaAs

^○R. Takasu¹, Y. Sato¹, T. Fujisawa¹ (1.Tokyo Tech (Japan))

2017 International Conference on Solid State Devices and Materials |Fri. Sep 22, 2017 2:40 PM - 2:55 PM |PDF Download

[D-1-01 (Invited)] Physical modeling of carbon nanotube based nanoelectromechanical memory cell SET and RESET operations

^○M. Stopa¹, T. Rueckes¹ (1.Nantero, Inc. (USA))

2017 International Conference on Solid State Devices and Materials |Wed. Sep 20, 2017 1:30 PM - 2:00 PM |PDF Download

[D-1-02] Differential Contact RRAM Pair for Advanced CMOS Logic NVM applications

^○W. -T. Hsieh¹, C. -J. Lin¹, Y. -C. King¹, Y. -D. Chih², J. Chang² (1.National Tsing Hua Univ., Hsinchu (Taiwan), 2.Taiwan Semiconductor Manufacturing Company (Taiwan))

2017 International Conference on Solid State Devices and Materials |Wed. Sep 20, 2017 2:00 PM - 2:20 PM |PDF Download

[D-1-03] Twin-bit Via RRAM in 16nm FinFET Logic Technologies

^○Y. -H. Shih¹, M. -Y. Hsu¹, Y. -C. King¹, C. -J. Lin¹ (1.National Tsing Hua Univ. (Taiwan), 2.Taiwan Semiconductor Manufacturing Company (Taiwan))

2017 International Conference on Solid State Devices and Materials |Wed. Sep 20, 2017 2:20 PM - 2:40 PM |PDF Download

[D-1-04] OxRAM integration above FDSOI transistor drain: Integration approach and process impact on electrical characteristics

^○M. Barlas¹, L. Grenouillet¹, E. Vianello¹, V. Delaye¹, T. Dewolf¹, G. Audoit¹, N. Rambal¹, S. Bernasconi¹, C. Vizioz¹, N. Posseme¹, S. Barnola¹, B. Bouix¹, O. Pollet¹, C. Comboroure², N. Allouti¹, P. Rodriguez¹, V. Beugin¹, V. Loup¹, C. Tallaron², S. Chevalliez², R. Coquand¹, C. Jahan¹, S. Reboh¹, A. Toffoli¹, S. Barraud¹, L. Brevard¹, Y. Morand¹, M. Vinet¹, O. Faynot¹, L. Perniola¹ (1.CEA-LETI (France), 2.STMicroelectronics (France))

2017 International Conference on Solid State Devices and Materials |Wed. Sep 20, 2017 2:40 PM - 3:00 PM |PDF Download