[B-9-04] STDP-like pulse response characteristics of interface dipole modulation FETs

〇Noriyuki - Miyata¹ (1. National Institute of Advanced Industrial Science and Technology(Japan))

2020 International Conference on Solid State Devices and Materials |Wed. Sep 30, 2020 3:00 PM - 3:15 PM |PDF Download

[B-9-05] Computation-In-Memory (CIM) with Logic-Process-Compatible Embedded Non-Volatile Memory for Neural Network

〇Hsueh-Wei Chen¹, Ying-Je Chen¹, Woan-Yun Hsiao¹, Wei-Ren Chen¹, Hung-Yi Liao¹, Wein-Town Sun¹, Ching-Yuan Lin¹ (1. eMemory Tech. Inc.(Taiwan))

2020 International Conference on Solid State Devices and Materials |Wed. Sep 30, 2020 3:15 PM - 3:30 PM |PDF Download

[C-1-01 (Invited)] Novel low k Dielectric materials for nano device interconnect technology

〇Son Nguyen¹, Hosadurga Shobha¹, Thomas Haigh¹, James Chen¹, Joe Lee¹, Takeshi Nogami¹, Eric Liniger¹, Stephan Cohen¹, Chao-Kun Hu¹, Huai Huang¹, Yiping Yao¹, Donald Canaperi¹, Cornelius Brown Peethala¹, Theo Standaert¹, Griselda Bonilla¹ (1. IBM Research(United States of America))

2020 International Conference on Solid State Devices and Materials |Mon. Sep 28, 2020 2:00 PM - 2:30 PM |PDF Download

[C-1-02] Development of Functional Interposer Using Bumpless Chip-on-Wafer
- Feasibility Study of Voidless Bonding with Thin Adhesive -

〇Yoshiaki Satake^1,2, Tatsuya Funaki^1,2, Kazuhiro Tabata^1,2, Kyosuke Kobinata^1,3, Young Suk Kim^1,3, Takayuki Ohba¹ (1. WOW Alliance, Tokyo Institute of Technology(Japan), 2. Murata Manufacturing Co.,Ltd.(Japan), 3. DISCO Corp.(Japan))

2020 International Conference on Solid State Devices and Materials |Mon. Sep 28, 2020 2:30 PM - 2:45 PM |PDF Download

[C-1-03] Development of Manganese Nitride Wiring with High Thermal Stability Caused by Saturation of the Mean Free Path

〇Hisashi Kino¹, Aoba Onishi¹, Takafumi Fukushima¹, Tetsu Tanaka¹ (1. Tohoku Univ.(Japan))

2020 International Conference on Solid State Devices and Materials |Mon. Sep 28, 2020 2:45 PM - 3:00 PM |PDF Download

[C-1-04] Barrier properties of thin TaWN films in Cu(111)/TaWN/Si systems

〇Mayumi B. Takeyama¹, Masaru Sato¹, Mitsunobu Yasuda² (1. Kitami Inst. & Technol.(Japan), 2. Toray Research Center, Inc.(Japan))

2020 International Conference on Solid State Devices and Materials |Mon. Sep 28, 2020 3:00 PM - 3:15 PM |PDF Download

[C-1-05] Preparation of reactively sputtered ZrO₂ films at low temperatures

〇Masaru Sato¹, Mayumi B. Takeyama¹ (1. Kitami Inst. of Tech.(Japan))

2020 International Conference on Solid State Devices and Materials |Mon. Sep 28, 2020 3:15 PM - 3:30 PM |PDF Download

[C-2-01] Efficient MoCl₅ Intercalation Doping of Multilayer Graphene for Low-Resistance and Low-Damage

〇EKKAPHOP KETSOMBUN¹, KAZUYOSHI UENO^1,2 (1. Shibaura Inst. of Tech.(Japan), 2. Res. Center for Green Innovation, SIT(Japan))

2020 International Conference on Solid State Devices and Materials |Mon. Sep 28, 2020 4:00 PM - 4:15 PM |PDF Download

[C-2-02] Analysis and Optimization of Corner Effect of TSV Array in 3D Integrated Circuits

〇Yingwei An¹, Xiaoxia Sun³, Yudi Zhao^1,2, Min Miao^1,2, Kai Zhao^1,2 (1. Info. Sci. and Tech. Univ. of Beijing(China), 2. Peking Univ.(China), 3. Labor Relations Univ. of China(China))

2020 International Conference on Solid State Devices and Materials |Mon. Sep 28, 2020 4:15 PM - 4:30 PM |PDF Download

[C-2-03] 3D Packaging and Integration Technology using Photosensitive Mold

〇Kentaro Mori¹, Soichi Yamashita¹, Masahiro Sekiguchi¹ (1. Toshiba Electronic Devices & Storage Corp.(Japan))

2020 International Conference on Solid State Devices and Materials |Mon. Sep 28, 2020 4:30 PM - 4:45 PM |PDF Download