2017 International Conference on Solid State Devices and Materials

Sep 19, 2017 - Sep 22, 2017
Sendai International Center

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763 results (191 - 200)

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[H-3-01 (Invited)] Effect of Metallization on the Microstructural Evolution of Microbump under Electric Current Stressing

C. -W. Chen¹,^○K. -L. Lin¹ (1.National Cheng Kung Univ. (Taiwan))

2017 International Conference on Solid State Devices and Materials |Thu. Sep 21, 2017 9:30 AM - 10:00 AM |PDF Download

[H-3-02] Enhancement of Direct Cu Bonding via Pulsed Flash Light

^○J. -M. Song¹, S. -Y. Liang¹, P. -H. Chiang¹, S. -K. Huang², Y. -T. Chiu², D. Tarng², C. -P. Hung² (1.National Chung Hsing Univ. (Taiwan), 2.Advanced Semiconductor Engineering Group (Taiwan))

2017 International Conference on Solid State Devices and Materials |Thu. Sep 21, 2017 10:00 AM - 10:20 AM |PDF Download

[H-3-03] Low Temperature Cu to Cu Direct Bonding in Atmosphere Environment Using Pillar-Concave Structure in 3D Integration

^○T. -C. Chou¹ (1.National Chiao Tung Univ. (Taiwan))

2017 International Conference on Solid State Devices and Materials |Thu. Sep 21, 2017 10:20 AM - 10:40 AM |PDF Download

[H-3-04] Development of a technology platform using advanced die-first FOWLP for highly integrated flexible hybrid electronics

^○T. Fukushima^1,2, A. Alam¹, A. Hanna¹, S. C. Jangam¹, A. Bajwa¹, S. S. Iyer¹ (1.UCLA (USA), 2.Tohoku Univ. (Japan))

2017 International Conference on Solid State Devices and Materials |Thu. Sep 21, 2017 10:40 AM - 11:00 AM |PDF Download

[H-3-05] N5 BEOL Process Options Patterning flows Comparing 193immersion to Hybrid EUV or Full EUV

^○S. Lariviere¹, B. Briggs¹, C. Wilson¹, D. Wan¹, A. Mallik¹, S. Decoster¹, J. Bekaert¹, V. Blanco¹, M. Mao¹, S. Paolillo¹, B. K. Kotowska¹, J. Versluijs¹, J. Boemmels¹, D. Trivkovic¹, Z. Tokei¹, G. Mcintyre¹, D. Mocuta¹ (1.IMEC (Belgium))

2017 International Conference on Solid State Devices and Materials |Thu. Sep 21, 2017 11:00 AM - 11:20 AM |PDF Download

[H-4-01] Impacts of annealing on interfaces of Al foil/Si junctions by using surface activated bonding

^○K. Furuna¹, J. Liang¹, M. Matsubara², D. Marwan², Y. Nishio², N. Shigekawa¹ (1.Osaka City Univ. (Japan), 2.Toyo Aluminium K.K. (Japan))

2017 International Conference on Solid State Devices and Materials |Thu. Sep 21, 2017 2:00 PM - 2:20 PM |PDF Download

[H-4-02] Fabrication of Mechanical Durable Glass Nanopillar with Bridged Structure

^○H. Kuwae¹, T. Sudo¹, K. Takayama², S. Shoji¹, J. Mizuno¹ (1.Waseda Univ. (Japan), 2.Asahi Glass Corp. (Japan))

2017 International Conference on Solid State Devices and Materials |Thu. Sep 21, 2017 2:20 PM - 2:40 PM |PDF Download

[H-4-03] Influence of atomic species of fast atom bombardment for surface activated bonding interface of germanium

^○M. Fujino¹, G. Kono¹, T. Suga¹ (1.Univ. of Tokyo (Japan))

2017 International Conference on Solid State Devices and Materials |Thu. Sep 21, 2017 2:40 PM - 3:00 PM |PDF Download

[H-4-04] Bonding and Debonding of Si/Glass based on SAB Method Combined with Hydrophilic Treatment

^○K. Takeuchi¹, Y. Matsumoto², T. Suga¹ (1.Univ. of Tokyo (Japan), 2.Lan Technical Service Co., Ltd. (Japan))

2017 International Conference on Solid State Devices and Materials |Thu. Sep 21, 2017 3:00 PM - 3:20 PM |PDF Download

[H-4-05 (Late News)] Au thin film wafer bonding after degas annealing for MEMS packaging

^○T. Matsumae¹, Y. Kurashima¹, H. Takagi¹ (1.AIST (Japan))

2017 International Conference on Solid State Devices and Materials |Thu. Sep 21, 2017 3:20 PM - 3:35 PM |PDF Download

763 results (191 - 200)

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