2017 International Conference on Solid State Devices and Materials

Sep 19, 2017 - Sep 22, 2017
Sendai International Center

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763 results (201 - 210)

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[H-5-01 (Invited)] Advanced Packaging Technology to Address Micro-bump Solder Bonding and Warpage in Large-die 3D IC using 22nm ULK Dielectrics

^○K. Sakuma¹, J. Knickerbocker¹ (1.IBM T. J. Watson Research Center (USA))

2017 International Conference on Solid State Devices and Materials |Fri. Sep 22, 2017 9:30 AM - 10:00 AM |PDF Download

[H-5-02] Evaluation of Substrate Noise Suppression Method to Mitigate Crosstalk among TSVs

^○Y. Araga¹, K. Kikuchi¹, M. Aoyagi¹ (1.AIST (Japan))

2017 International Conference on Solid State Devices and Materials |Fri. Sep 22, 2017 10:00 AM - 10:20 AM |PDF Download

[H-5-03] The large-area backside etching method by changing backside layout using loading effect and ARDE for foundry-based fabrication

Y. Okamoto¹, ^○Y. Tohyama¹, N. Usami¹, Y. Mita¹ (1.Univ. of Tokyo (Japan))

2017 International Conference on Solid State Devices and Materials |Fri. Sep 22, 2017 10:20 AM - 10:40 AM |PDF Download

[H-5-04] Characterization of Cu-TSVs Fabricated by a New All-Wet Process

^○M. Xiong^1,2, Y. Yan², Y. Ding², H. Kino¹, T. Fukushima¹, T. Tanaka¹ (1.Tohoku Univ. (Japan), 2.Beijing Inst. of Tech. (China))

2017 International Conference on Solid State Devices and Materials |Fri. Sep 22, 2017 10:40 AM - 11:00 AM |PDF Download

[H-6-01 (Invited)] Heterogeneous Integration Based on Low-Temperature Bonding for Advanced Optoelectronic Devices

^○E. Higurashi^1,2 (1.AIST (Japan), 2.Univ. of Tokyo (Japan))

2017 International Conference on Solid State Devices and Materials |Fri. Sep 22, 2017 11:15 AM - 11:45 AM |PDF Download

[H-6-02] Membrane-based GaInAs/InP waveguide-type p-i-n photodetector fabricated on Si substrate using Benzocyclobutene bonding

^○Z. Gu¹, T. Uryu¹, D. Inoue¹, T. Amemiya¹, N. Nishiyama¹, S. Arai¹ (1.Tokyo Tech (Japan))

2017 International Conference on Solid State Devices and Materials |Fri. Sep 22, 2017 11:45 AM - 12:00 PM |PDF Download

[H-6-03] Fabrication of VTPC-TG Pixels for 3D Structure CMOS Image Sensor Applications

S.-K. Park¹,^○D. Woo¹, M.-K. Na¹, P.-S. Kwag¹, H.-R. Lee¹, K.-W. Ro¹, K.-H. Kim¹, D.-K. Lee¹, C. Hong¹, I.-W. Cho¹, J.-H. Park², K.-D. Yoo² (1.SK Hynix (Korea), 2.Hanyang Univ. (Korea))

2017 International Conference on Solid State Devices and Materials |Fri. Sep 22, 2017 12:00 PM - 12:15 PM |PDF Download

[H-6-04 (Late News)] Influence of different plasma treatments on low-temperature Au-Au bonding and its application to hermetic packaging

^○M. Yamamoto¹, E. Higurashi^1,2, T. Suga¹, R. Sawada³, T. Itoh¹ (1.Univ. of Tokyo (Japan), 2.AIST (Japan), 3.Kyushu Univ. (Japan))

2017 International Conference on Solid State Devices and Materials |Fri. Sep 22, 2017 12:15 PM - 12:30 PM |PDF Download

[H-7-01 (Invited)] High power Silicon laser based on the dressed photon technology

^○T. Kawazoe¹ (1.Tokyo Denki Univ. (Japan))

2017 International Conference on Solid State Devices and Materials |Fri. Sep 22, 2017 1:40 PM - 2:10 PM |PDF Download

[H-7-02] 1.7 µm Wavelength Tunable Laser Diode Using Silicon External Cavity

^○S. Takei¹, T. Kita¹, H. Yamada¹ (1.Tohoku Univ. (Japan))

2017 International Conference on Solid State Devices and Materials |Fri. Sep 22, 2017 2:10 PM - 2:25 PM |PDF Download

763 results (201 - 210)

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