[H-6-05] Phonon-assisting injection three quantum-levels terahertz quantum cascade lasers for high-temperature operation

^○Li Wang¹, Mingxi Chen¹, Tsung-Tse Lin¹, Ke Wang², Hideki Hirayama¹ (1. Terahertz quantum device research team, RIKEN center for advanced photonics (Japan), 2. Nanjing university (China))

2023 International Conference on Solid State Devices and Materials |Fri. Sep 8, 2023 11:45 AM - 12:00 PM |PDF Download

[H-7-01 (Invited)] Paradigm Shift of Photonics with Silicon

^○Koji Yamada¹ (1. Nat'l Inst. of Adv. Indus. Sci. and Tech. (Japan))

2023 International Conference on Solid State Devices and Materials |Fri. Sep 8, 2023 1:30 PM - 2:00 PM |PDF Download

[H-7-02] Compact passive waveguides using mosaic-based device with triangular lattice photonic crystal-like structure

^○Takuya Mitarai^1,2, Takeshi Fujisawa³, Yusuke Sawada^1,2, Takuya Okimoto^1,2, Naoya Kono², Naoki Fujiwara^1,2, Taichi Muratsubaki³, Takanori Sato³, Kunimasa Saitoh³, Hideki Yagi^1,2 (1. Photonics Electronics Tech. Res. Assoc. (Japan), 2. Sumitomo Electric Industries, Ltd. (Japan), 3. Hokkaido Univ. (Japan))

2023 International Conference on Solid State Devices and Materials |Fri. Sep 8, 2023 2:00 PM - 2:15 PM |PDF Download

[H-7-03] Port switching of topological edge transmission using phase interference on Si-topological waveguide

^○Sho Okada¹, Tomohiro Amemiya¹, Itsuki Sakamoto¹, Ken Hattori¹, Nobuhiko Nishiyama^1,2, Xiao Hu³ (1. Tokyo Tech. (Japan), 2. IIR (Japan), 3. NIMS (Japan))

2023 International Conference on Solid State Devices and Materials |Fri. Sep 8, 2023 2:15 PM - 2:30 PM |PDF Download

[H-7-04] Numerical Evaluation of Modulation Bandwidth and Insertion Loss in InP-EO Polymer Hybrid Optical Modulator with Doping Optimization

^○Hiroya Sakumoto¹, Taketoshi Nakayama¹, Yuto Miyatake¹, Kasidit Toprasertpong¹, Shinichi Takagi¹, Mitsuru Takenaka¹ (1. Univ. of Tokyo (Japan))

2023 International Conference on Solid State Devices and Materials |Fri. Sep 8, 2023 2:30 PM - 2:45 PM |PDF Download

[H-7-05] Development of a 200 mm Wafer Silicon Nitride PIC Environment for Graphene Electro-Absorption Modulators

^○Rasuole Lukose¹, Marco Lisker^1,2, Pawan Kumar Dubey¹, Md Ashraful Islam Raju¹, Anna Peczek¹, Aleksandra Kroh¹, Mindaugas Lukosius¹, Andreas Mai^1,2 (1. IHP- Leibniz Institut für innovative Mikroelektronik (Germany), 2. Technical University of Applied Science Wildau (Germany))

2023 International Conference on Solid State Devices and Materials |Fri. Sep 8, 2023 2:45 PM - 3:00 PM |PDF Download

[J-3-01] A 351pW Stand-By Power 0.017mm² 37.4GHz Fully-Integrated LC Oscillator-Based OOK Transmitter Using Low-Leakage Switch in 22nm CMOS

^○Kiichi Niitsu¹, Jin Nakamura², Masaya Kaneko², Yuya Osaki², Hiroki Wakatsuchi³ (1. Kyoto Univ. (Japan), 2. Meitec Corp. (Japan), 3. Nagoya Inst. Tech. (Japan))

2023 International Conference on Solid State Devices and Materials |Thu. Sep 7, 2023 9:00 AM - 9:15 AM |PDF Download

[J-3-02] A High-Resolution Ultrasonic Water Flow Meterwith Multi-Phase Time-Zooming Technique and Active Band Pass Filter

^○Junpei Oda¹, Yuta Kaga¹, Koh Johguchi¹ (1. Shinshu Univ. (Japan))

2023 International Conference on Solid State Devices and Materials |Thu. Sep 7, 2023 9:15 AM - 9:30 AM |PDF Download

[J-3-03] A 1.58nJ/Conversion Temperature-to-Digital Converter with Low Power Variations

Mao-Wei Lee¹, Po-Wei Lai¹, Ching-Hsiang Chang¹, ^○Hongchin Lin¹ (1. National Chung Hsing Univ. (Taiwan))

2023 International Conference on Solid State Devices and Materials |Thu. Sep 7, 2023 9:30 AM - 9:45 AM |PDF Download

[J-3-04] Low Quiescent Current LDO with FVF-Based PSRR Enhanced Circuit for EEG Recording Wearable Devices

^○Kenji Mii¹, Daisuke Kanemoto¹, Tetsuya Hirose¹ (1. Osaka Univ. (Japan))

2023 International Conference on Solid State Devices and Materials |Thu. Sep 7, 2023 9:45 AM - 10:00 AM |PDF Download