2023 International Conference on Solid State Devices and Materials

2023年9月5日〜 2023年10月31日
Nagoya Congress Center

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633件中(501 - 510)

[PS-2-19] Effect of Geometrical Variations on Bulk FinFET-Based Capacitorless DRAM

^○Min Seok Kim¹, Sang Ho Lee¹, Jin Park¹, Ga Eon Kang¹, Jun Hyeok Heo¹, So Ra Jeon¹, Jeong Woo Hong¹, Seung Ji Bae¹, In Man Kang¹ (1. Kyungpook National Univ. (Korea))

2023 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-20] Improvement of Read Performance using CMOS on Array(COA) in 3D NAND Flash

Daewoong Kang³, ^○Hyowon Kang¹, Hyoungsoo Kim² (1. Korea Int’l School (Korea), 2. California State Polytechnics Uni (United States of America), 3. Soul National Uni (Korea))

2023 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-21] High-Speed Operation at 25ns Enabled by Angstrom Layer HZO Technology in MFS IGZO Device with Ultra-Wide Memory Window and Low Thermal Budget

^○CHENG- RUI LIU¹, SHENG-MIN WANG¹, YU-TING CHEN¹, SHAO-CHEN LEE¹, YING-TSAN TANG¹ (1. National Central Univ. (Taiwan))

2023 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-22] 2 bit/cell Dynamic Flash Memory with Three Gates

^○Koji Sakui¹, Yisuo Li¹, Yoshihisa Iwata¹, Masakazu Kakumu¹, Nozomu Harada¹ (1. Unisantis Electronics Singapore (Singapore))

2023 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-23] Improved Synaptic Plasticity of Li Ion-Gated Transistors with Mg-Doped LiCoO2 Channel for Neuromorphic Computing

^○Samapika Mallik¹, Tohru Tsuruoka², Takashi Tsuchiya³, Kazuya Terabe ⁴ (1. National Inst. for materials sci. (Japan), 2. National Inst. for materials sci. (Japan), 3. National Inst. for materials sci. (Japan), 4. National Inst. for materials sci. (Japan))

2023 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-24] Positive Feedback Field Effect Transistor Based on Vertical NAND Flash Structure for In-Memory Computing

^○Junhyeong Lee¹, Misun Cha¹, Min-Woo Kwon¹ (1. Gangneung-Wonju National Univ (Korea))

2023 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-3-01] Development of Low-thermal-budget and Low-electrical-loss Heterogeneous Integration Platform by Glass Substrate and Area-Selective Passivation Technology

^○Mu-Ping Hsu¹, Hsin-Chi Chang¹, Yi-Chieh Tsai¹, Kuan-Neng Chen¹ (1. National Yang Ming Chiao Tung Univ. (Taiwan))

2023 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-3-02] Using a CMOS MEMS Resonator System for Rapid Calibration of Thin Film Deposition Thickness

^○Cheng-Yang Chang¹, Chin-Te Hsin¹, Ying-Zong Juang¹, Sheng-Hsiang Tseng¹ (1. National Applied Research Laboratories Taiwan Semiconductor Research Institute (Taiwan))

2023 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-3-03] On the Study of ESD-Induced Electromigration in CMOS Metallization

^○Yang-Shou Hou¹, Chun-Yu Lin¹ (1. National Taiwan Normal Univ. (Taiwan))

2023 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-3-04] Characteristic Verification of Flexible Printed Circuit Applied to System Circuit and Package with High Frequency and High Speed

^○Meng-Hua TU¹, CHIA-LIN HSIEH¹, Sung-Mao Wu¹, Shang-Chih Chou² (1. National University of Kaohsiung (Taiwan), 2. Taiwan Textile Research Institute (Taiwan))

2023 International Conference on Solid State Devices and Materials |PDF ダウンロード

633件中(501 - 510)