[P-2-10] Simulation and fabrication of embedded capacitors in the multilayer printed circuit board

Hee-Wook You, Jung-Hyuk Koh (1.Dept. of Electronic materials engineering. Kwangwoon Univ.)

2007 International Conference on Solid State Devices and Materials |PDF Download

[P-2-11] Non-destructive extraction of width bias variations for deep sub-micron interconnect lines

Mao-Chyuan Tang, Meng-Feng Wang, Tim Cheng, David Chen, C S Yeh, S C Chien (1.Central R & D Division, United Microelectronics Corp.)

2007 International Conference on Solid State Devices and Materials |PDF Download

[P-2-12] Transmission property of flip chip package with adhesive interconnection for high frequency applications

Jong-Woong Kim, Jae-Hoon Ko, Wansoo Nah, Seung-Boo Jung (1.School of Advanced Materials Science & Engineering, Sungkyunkwan University, 2.School of Electrical and Computer Engineering, Sungkyunkwan University)

2007 International Conference on Solid State Devices and Materials |PDF Download

[P-2-13] SAW Bumpless Bonding at Low Temperature in Ambient Air

Ying-Hui Wang, Takahiro Sato, Tsuyoshi Sugiura, Tadatomo Suga (1.Univ. of Tokyo, Dept. of Precision Eng. School of Eng., 2.Wireless Communication Laboratory, Samsung Yokohama Research Institute)

2007 International Conference on Solid State Devices and Materials |PDF Download

[P-2-14] Void Free Room Temperature Silicon Direct Bonding by Sequential Plasma Activated Process

Chenxi Wang, Eiji Higurashi, Tadatomo Suga (1.Department of Precision Engineering, School of Engineering, The University of Tokyo, 2.Research Center for Advanced Science and Technology, The University of Tokyo)

2007 International Conference on Solid State Devices and Materials |PDF Download

[P-3-1] Impact of Zr/Hf Ratio on Reliability of HfZrOX Gate Dielectric

J.C. Liao, Y.K. Fang*, Y.T. Hou, W. H. Tseng, J. Y. Yang, P.F. Hsu, Y.S. Chao, K.C. Lin, K.T. Huang, T.L. Lee, M.S. Liang (1.VLSI Technology Laboratory, Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University, 2.Taiwan Semiconductor Manufacturing Company)

2007 International Conference on Solid State Devices and Materials |PDF Download

[P-3-2] Current Transportation Mechanism of HfO2 Gate Dielectrics with Silicon Surface Fluorine Implantation (SSFI) in CMOS Application

Woei Cherng Wu, Chao Sung Lai, Tsui Ming Wang, Jer Chyi Wang, Ming Wen Ma, Tien Sheng Chao (1.Department of Electronic Physics, National Chiao Tung University, 2.Department of Electronic Engineering, Chang Gung University, 3.Nanya Technology Corporation, 4.Department of Electronics Engineering, National Chiao Tung University)

2007 International Conference on Solid State Devices and Materials |PDF Download

[P-3-3] Extra Bonus on Transistor Optimization with Stress Enhanced Notch-gate Technology for sub-90nm CMOSFET

W.-K. Yeh, C.-M. Lai, Y.-K. Fang, C.-W. Hsu, C.-T. Lin, C.-H. Hsu, L.-W. Chen, Y.-T. Huang, C.-T. Tsai (1.Department of Electrical Engineering, National University of Kaohsiung, 2.Institute of Microelectronics, National Cheng Kung University, 3.United Microelectronics Corporation, Central R&D Division)

2007 International Conference on Solid State Devices and Materials |PDF Download

[P-3-4] Performance Comparison of Ultra-thin FD-SOI Inversion-, Intrinsic- and Accumulation-Mode MOSFETs

Rihito Kuroda, Akinobu Teramoto, Shigetoshi Sugawa, Tadahiro Ohmi (1.Graduate School of Engineering, Tohoku University, 2.New Industry Creation Hatchery Center, Tohoku University, 3.JSPS Research Fellow (DC1))

2007 International Conference on Solid State Devices and Materials |PDF Download

[P-3-5] In-situ comparison of Si/High-K and Si/SiO2 interface properties in FD SOI MOSFETs operated at low temperature

L. Pham-Nguyen, C. Fenouillet-Beranger, S. Cristoloveanu, A. Vandooren, M. Orlowski, G. Ghibaudo (1.IMEP-INPG MINATEC, 2.FREESCALE Semiconductors, 3.ST Microelectronics)

2007 International Conference on Solid State Devices and Materials |PDF Download