[H-5-2] A Novel Surface Nano-Structure Design for SiGe/Si Type-II Hetero-Junction Solar Cell

M. H. Liao¹、C. H. Chen¹、L. C. Chang¹、C. Yang¹、S. C. Kao¹、C. F. Hsieh² (1.National Taiwan Univ.、2.Industrial Tech. Research Inst. , Taiwan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-5-3] Imaging of transient photoexcited current in solar cell using femtosecond laser pulses

H. Nakanishi¹、K. Salek²、A. Ito¹、K. Takayama²、I. Kawayama²、H. Murakami²、M. Tonouchi² (1.Dainippon Screen Manufac.、2.Osaka Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-5-1L] Low-Resistance TCO n-p Tunnel Recombination Junction for Multi-Cell Interface Layers in Thin-Film Solar Cells

K. Kanamoto¹、H. Tokioka¹、H. Konishi¹、M. Yamamuka¹、H. Fuchigami¹、Y. Tsuda¹、M. Inoue¹ (1.Mitsubishi Electric Corp. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-6-1] Development of magnetic field microscopy for interconnection testing inside passivation layer

K. Kimura¹、Y. Mima¹、N. Oyabu²、N. Kimura³、T. Inao⁴ (1.Univ. of Kobe、2.Univ. of Kyoto、3.Univ. of Osaka、4.Murata Manufacturing Company , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-6-2] Characterization of Tungsten-Based Pillars Deposited by Helium Ion Microscope Equipped with Gas Injection System

K. Kohama¹、T. Iijima¹、M. Hayashida¹、S. Ogawa¹ (1.AIST , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-6-3] MIM Capacitors with High Capacitance Density and Low Quadratic Voltage Coefficient Employing Canceling Effect by ZrLaOx/ZrTiOx/ZrLaOx Laminate Insulator

L. L. Chen¹、Y. B. Lin¹、C. C. Lin¹、Y. T. Chang¹、Y. H. Wu¹ (1.National Tsing Hua Univ. , Taiwan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-6-4] Reliability of MIM Capacitors Under Pads for Au or Cu Wire Bonding

J. P. Gambino¹、C. Griffin¹、K. Watson¹、J. Malinowski¹、A. Cote¹、B. Guthrie¹、A. Vize¹、T. Aoki² (1.IBM Microelectronics , USA、2.IBM Yamato Laboratory , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-6-5] Fat damascene wires for high bandwidth routing in silicon interposer

M. Detalle¹、J. Kim¹、P. Nolmans¹、X. Sun¹、J. Ryckaert¹、A. La Manna¹、G. Beyer¹、E. Beyne¹ (1.InterUniv. MicroElectronics Center , Belgium)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-6-6L] Development of Cu/insulation layer interface crack extension simulation with single crystal plasticity

K. Koiwa^1,2、M. Omiya^2,3、N. Shishido^1,2、S. Kamiya^1,2、H. Sato^1,2、M. Nishida^1,2、T. Suzuki^2,5、T. Nakamura⁴、T. Nokuo^2,5 (1.Nagoya Inst. of Tech.、2.Japan Sci. and Tech. Agency、3.Keio Univ.、4.Fujitsu labs. Ltd.、5.JEOL Ltd. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[I-1-1] Interface Control of III-Oxide/Nitride Composite Structures

M. Higashiwaki^1,2、S. Chowdhury³、B. R. Swenson³、U. K. Mishra³、T. Igaki⁴、T. Yamaguchi⁴、T. Honda⁴ (1.National Inst. of Information and Communications Tech.,、2.PRESTO, Japan Science and Tech. Agency, , Japan、3.Department of Electrical and Computer Engineering, Univ. of California, , USA、4.Department of Electrical Engineering and Electronics, Kogakuin Univ., , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード