[C-9-4] Materials Engineering for Future Interconnects: "Catalyst-free" Electroless Cu Deposition on Self-assembly Monolayer Alternative Barriers

S. Armini¹, C. M. Whelan¹ (1.IMEC, Belgium)

2008 International Conference on Solid State Devices and Materials |PDF Download

[C-9-5] Kinetics of Self-Formation of Ti-based Barrier Layers in Cu(Ti)/Dielectric-Layer Samples

K. Kohama¹, K. Ito¹, K. Mori², K. Maekawa², Y. Shirai¹, M. Murakami³ (1.Kyoto Univ., 2.Renesas Tech. Corp., 3.Ritsumeikan Trust, Japan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[C-10-1] Galvanic Corrosion Control during Cu Chemical Mechanical Polishing of Cu Interconnects that Contain Ruthenium Barrier Metal Film

K. Maruyama¹, M. Shiohara¹, K. Yamada¹, S. Kondo¹, S. Saito¹ (1.Selete, Japan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[C-10-2] FDC and APC System Approach to Stabilize Cu CMP Process in Mass Production Line (Invited)

H. Tsuchiyama¹, K. Tamaki² (1.Renesas Tech. Corp., 2.Hitachi, Ltd., Japan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[C-10-3] Defect-less Monolithic Low-k/Cu Interconnects by Chemistry-controlled CMP

M. Ueki¹, T. Onodera¹, A. Ishikawa², S. Hoshino², Y. Hayashi¹ (1.NEC Electronics Corp., 2.Nikon Corp., Japan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[D-1-1] Millimeter-Wave CMOS Pulse Communication (Invited)

M. Fujishima¹ (1.Univ. of Tokyo, Japan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[D-1-2] Characteristics of Si On-chip Integrated Antennas Fabricated on Dielectric Substrates

W. Moriyama¹, K. Kimoto¹, S. Kubota¹, N. Sasaki¹, T. Kikkawa¹ (1.Hiroshima Univ., Japan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[D-1-3] A 2-GHz-band CMOS Low Noise Amplifier with High-Q Inductors Embedded in Wafer-Level Package

S. Sadoshima¹, S. Fukuda¹, H. Ito¹, K. Itoi², M. Sato², T. Ito², R. Yamauchi², K. Okada¹, N. Ishihara¹, K. Masu¹ (1.Tokyo Tech., 2.Fujikura Ltd., Japan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[D-1-4] A High IIP3 Image Rejection Filter with Current Adapted Buffers for a Digital/Analog TV Tuner IC in a 0.25 μm RF-CMOS Technology

T. Kamata^1,2, T. Matsuoka¹, K. Taniguchi¹ (1.Osaka Univ., 2.RfStream Corp., Japan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[D-1-5] A 10 Gbit/s Optical Receiver Analog Front-End with Input Parasitic Capacitance Immunization Technique

J. C. Huang¹, Y. S. Lai¹, K. Y. J. Hsu¹ (1.National Tsing Hua Univ., Taiwan)

2008 International Conference on Solid State Devices and Materials |PDF Download

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