[E-7-4] Fabrication of IGZO Thin-Film Transistors with Film Profile Engineering

R.J. Lyu¹、H.C. Lin^1,2、T.Y. Huang¹ (1.NCTU、2.National Nano Device Labs. (Taiwan))

2014 International Conference on Solid State Devices and Materials |PDF ダウンロード

[E-7-5] Impact of Oriented Crystalline InGaZnO Semiconductor on Electrical Properties of Thin Film Transistor

S.S. Yen¹、H.H. Hsu¹、P. Chiou¹、C.H. Cheng²、C.Y. Chang¹、Y.C. Lai³、C.P. Chang³、H.H. Lu³、C.S. Chuang³、Y.H. Lin³ (1.NCTU、2.National Taiwan Normal Univ.、3.AU Optronics Corp. (Taiwan))

2014 International Conference on Solid State Devices and Materials |PDF ダウンロード

[E-8-1] High Performance III-V MOS Technologies

M.J.W. Rodwell¹、S. Lee¹、C.-Y. Huang¹、D. Elias¹、V. Chobpattana²、B.J. Thibeault¹、W. Mitchell¹、S. Stemmer²、A.C. Gossard² (1.ECE Dept. Univ. of California, Santa Barbara、2.Materials Dept. Univ. of California, Santa Barbara (USA))

2014 International Conference on Solid State Devices and Materials |PDF ダウンロード

[E-8-2] Hole Mobility Enhancements in Strained In_xGa_1-xSb Heterostructure PMOSFET

P.Y. Chang¹、X.Y. Liu²、L. Zeng²、G. Du² (1.School of Electronic and Computer Eng., Peking Univ.、2.Inst. of Microelectronics, Peking Univ. (China))

2014 International Conference on Solid State Devices and Materials |PDF ダウンロード

[E-8-3] Body Width Dependence of Subthreshold Slope and On-Current in GaAsSb/InGaAs Double-Gate Vertical Tunnel FETs

K. Ohashi¹、M. Fujimatsu¹、Y. Miyamoto¹ (1.Tokyo Tech (Japan))

2014 International Conference on Solid State Devices and Materials |PDF ダウンロード

[E-8-4] RF Modeling of III-V FINFETs

E. Lind¹、C.B. Zota¹、L.E. Wernersson¹ (1.Lund Univ. (Sweden))

2014 International Conference on Solid State Devices and Materials |PDF ダウンロード

[F-1-1] Heated Ion Implantation Technology for High Performance SOI FinFETs

W. Mizubayashi¹、H. Onoda¹、Y. Nakashima¹、Y. Ishikawa¹、T. Matsukawa¹、K. Endo¹、Y.X. Liu¹、S. O'uchi¹、J. Tsukada¹、H. Yamauchi¹、S. Migita¹、Y. Morita¹、H. Ota¹、M. Masahara¹ (1.AIST (Japan))

2014 International Conference on Solid State Devices and Materials |PDF ダウンロード

[F-1-2] Operations of CMOS Inverter and Ring Oscillator Composed of Ultra-Thin Body Poly-Ge p- and n-MISFETs for Stacked Channel 3D-IC

Y. Kamata¹、M. Koike¹、E. Kurosawa¹、M. Kurosawa²、H. Ota¹、O. Nakatsuka²、S. Zaima²、T. Tezuka¹ (1.Green Nanoelectronics Center (GNC), AIST、2.Nagoya Univ. (Japan))

2014 International Conference on Solid State Devices and Materials |PDF ダウンロード

[F-1-3] Atomically Flattening of Si Surface of SOI and Isolation-patterned Wafers

T. Goto¹、R. Kuroda²、N. Akagawa²、T. Suwa¹、A. Teramoto¹、X. Li²、S. Sugawa^1,2、T. Ohmi¹、Y. Kumagai³、Y. Kamata³、K. Sibusawa³ (1.NICHe, Tohoku Univ.、2.Graduate School of Engineering, Tohoku Univ.、3.LAPIS Semiconductor Miyagi Co., Ltd. (Japan))

2014 International Conference on Solid State Devices and Materials |PDF ダウンロード

[F-1-4] Large Size InGaAs-o-I Substrates Fabricated by Direct Wafer Bonding on Si

E. Uccelli¹、N. Daix¹、L. Czornomaz¹、D. Caimi¹、C. Rossel¹、M. Sousa¹、H. Siegwart¹、C. Marchiori¹、J.M. Hartmann²、K.T. Shiu³、C.W. Weng³、M. Krishnan³、M. Lofaro³、M. Kobayashi³、D. Sadana³、J. Fompeyrine¹ (1.IBM Zurich Research Laboratory、2.CEA, LETI、3.IBM T. J. Watson Research Center (Switzerland))

2014 International Conference on Solid State Devices and Materials |PDF ダウンロード