2016 International Conference on Solid State Devices and Materials

Sep 26, 2016 - Sep 29, 2016
Tsukuba International Congress Center, Tsukuba, Japan

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734 results (241 - 250)

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[K-2-02] Impact of Dry Process Damage on Chemical Mechanical Planarization with Cu/low-k Structure

^○M. Kodera¹, H. Yano¹, N. Miyashita¹ (1.Toshiba Corp.(Japan))

2016 International Conference on Solid State Devices and Materials |Tue. Sep 27, 2016 4:10 PM - 4:30 PM |PDF Download

[K-2-03] The Effect of the HfN_x Barrier Thickness on the Cu Grain Orientation Control

^○M. Sato¹, E. Aoyagi², M. B. Takeyama¹ (1.Kitami Inst. of Tech.(Japan), 2.Tohoku Univ.(Japan))

2016 International Conference on Solid State Devices and Materials |Tue. Sep 27, 2016 4:30 PM - 4:50 PM |PDF Download

[K-2-04(Late News)] Cost-effective Means to Improve Barrier Performance of Ti in Cu-TSVs for 3D Integration

^○M. Mariappan¹, J. Bea¹, T. Fukushima¹, M. Koyanagi¹ (1.Tohoku Univ.(Japan))

2016 International Conference on Solid State Devices and Materials |Tue. Sep 27, 2016 4:50 PM - 5:05 PM |PDF Download

[K-3-01(Invited)] Roles and Expectations for LSI and MEMS Technologies in the IoT Era

^○H. Morimura¹, S. Oshima¹, K. Matsunaga¹, A. Musa¹, T. Minotani², T. Kondo¹ (1.NTT Device Innovation Center, NTT Corp.(Japan), 2.NTT TELECON(Japan))

2016 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2016 9:30 AM - 10:00 AM |PDF Download

[K-3-02] Large Scale Integration of Silicon Nanomechanical Resonators above Industrial CMOS Wafers

W. Ludurczak¹,^○G. Gourlat¹, M. Gély¹, G. Billiot¹, J. Philippe¹, P. Villard¹, G. Sicard¹, T. Ernst¹, S. Hentz¹ (1.CEA-LETI(France))

2016 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2016 10:00 AM - 10:20 AM |PDF Download

[K-3-03] A Spring Design for Tri-axis MEMS Accelerometer by Multi-layer Metal Technology

^○D. Yamane¹, T. Konishi², T. Safu², H. Toshiyoshi³, M. Sone¹, K. Masu¹, K. Machida² (1.Tokyo Tech(Japan), 2.NTT Advanced Tech. Corp.(Japan), 3.Univ. of Tokyo(Japan))

2016 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2016 10:20 AM - 10:40 AM |PDF Download

[K-3-04] Thermal Change in Resonance Wavelength of Si Resonator Sensors on Si on Insulator Substrate and Solution by Differential Operation

^○A. K. Sana¹, S. Yokoyama¹, Y. Nakashima¹, Y. Amemiya¹, S. Yokoyama¹ (1.Hiroshima Univ.(Japan))

2016 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2016 10:40 AM - 11:00 AM |PDF Download

[K-4-01(Invited)] Materials Design of Electrically Conductive Pastes for Stretchable Device Packaging

^○M. Inoue¹, Y. Itabashi¹, Y. Tada¹ (1.Gunma Univ.(Japan))

2016 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2016 1:30 PM - 2:00 PM |PDF Download

[K-4-02] Solution-Processed Large-Area Discrete Organic Thin-Film Transistors

^○X. Liu¹, M. Kanehara², T. Minari¹ (1.NIMS(Japan), 2.Colloidal Ink. Co., Ltd.(Japan))

2016 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2016 2:00 PM - 2:20 PM |PDF Download

[K-4-03] MoCl₅ Intercalation Doping and Oxygen Passivation of Submicrometer-Sized Multilayer Graphene

^○H. Miyazaki¹, R. Matsumoto², M. Katagiri¹, K. Ueno³, T. Sakai¹, A. Kajita¹ (1.Toshiba Corp.(Japan), 2.Tokyo Polytechnic Univ.(Japan), 3.Shibaura Inst. of Tech.(Japan))

2016 International Conference on Solid State Devices and Materials |Wed. Sep 28, 2016 2:20 PM - 2:40 PM |PDF Download

734 results (241 - 250)

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