[P-1] The Relationship between Stanford and Silicon Valley: a Dean's Perspective

James F. Gibbons (1.Dean, School of Engineering, 1984-1996 Stanford University)

2000 International Conference on Solid State Devices and Materials |PDF Download

[P-2] SOP and SOC: the Best of Both

Rao R. Tummala (1.Pctit Chair Professor Director, NSF-ERC Packaging Research Center Georgia Eminent Scholar Georgia Institute of Technology)

2000 International Conference on Solid State Devices and Materials |PDF Download

[P-3] Required Device Technologies for Future Photonic Networks

Masao KAWACHI (1.NTT Network Innovation Laboratories)

2000 International Conference on Solid State Devices and Materials |PDF Download

[P-4] The Role Microfabrication in the Coming "Century of Biology"

D. Jed Harrison (1.Dept. of Chemistry, University of Alberta)

2000 International Conference on Solid State Devices and Materials |PDF Download

[A-1-1] Integrated Circuit Challenges, from Transistors to Packages

Mark Bohr (1.Portland Technology Development, Intel Corporation)

2000 International Conference on Solid State Devices and Materials |PDF Download

[A-1-2] New Mechanisms and the Characterization of Plasma Charging Enhanced Hot Carrier Effect in Deep-Submicron N-MOSFET's

S. J. Chen, H. L. Kao, Steve S. Chung, C. C. Chen, C. Y. Chang, H. C. Lin (1.Department of Electronic Engineering, National Chiao Tung University, 2.National Nano Device Lab.)

2000 International Conference on Solid State Devices and Materials |PDF Download

[A-1-3] Indium Profile Control for Super Steep Retrograde (SSR) Well

T. Matsuda, A. Mineji, N. Nishio, H. Kitajima (1.ULSI Device Development Division, NEC Electron Devices, NEC Corporation)

2000 International Conference on Solid State Devices and Materials |PDF Download

[A-1-4] A Study on Mechanism of Chemical Mechanical Polishing on Al and Cu Surfaces Employing In-situ Infrared Spectroscopy

Hiroki Ogawa, Yusuke Tokuyama, Michihiko Yanagisawa, Jun Kikuchi, Yasuhiro Horiike (1.Department of Materials Science, School of Engineering, University of Tokyo, 2.Speedfam-IPEC Co., Ltd., 3.Axiomatec Inc.)

2000 International Conference on Solid State Devices and Materials |PDF Download

[A-1-5] Characterization of Tungsten Carbide as Diffusion Barrier for Cu Metallization

Shui Jinn Wang, Hao Yi Tsai, S. C. Sun (1.Microelectronics Lab., Dept. of Electrical Engineering, National Cheng Kung University, 2.R&D, Wafertech)

2000 International Conference on Solid State Devices and Materials |PDF Download

[A-1-6] Aluminum Chemical Vapor Deposition Technology for High Deposition Rate and Surface Morphology Improvement

Chang-Hun Lee, Takamasa Nishimura, Kazuya Masu, Kazuo Tsubouchi (1.Research Institute of Electrical Communication, Tohoku University)

2000 International Conference on Solid State Devices and Materials |PDF Download