[F-2-3] InGaP/InGaAs DCFETs with Drain and Source Recess Process

Feng-Tso Chien, Jin-Mu Yin, Shin-Tzung Su, Ming-Hung Lai, Kou-Way Tu, Ching-Ling Cheng (1.Dept. of Electronic Engineering, Feng Chia University, 2.R&D Dept., Chino-Excel Technology Corp.)

2004 International Conference on Solid State Devices and Materials |PDF Download

[F-2-4] A New Camel-Gate Field Effect Transistor with a Composite Channel Structure

Po-Hsien Lai, Chih-Hung Yen, Chung-I Kao, Hung-Ming Chuang, Sheng-Fu Tsai, Chun-Yuan Chen, Wen-Chau Liu (1.Institute of Microelectronics, Department of Electrical Engineering, National Cheng-Kung University)

2004 International Conference on Solid State Devices and Materials |PDF Download

[F-2-5] Low-Frequency Noise Generated From High-Field Region in AlGaAs/InGaAs HEMTs

M. Wada, T. Nakamoto, S. Hamayoshi, K. Higuchi (1.Graduate School of Advanced Sciences of Matter Hiroshima University)

2004 International Conference on Solid State Devices and Materials |PDF Download

[F-2-6] Characteristics of an InGaAs/InGaAsP Composite-Collector Heterojunction Bipolar Transistor (CCHBT)

Jing-Yuh Chen, Chun-Yuan Chen, Ssu-I Fu, Chi-Yuan Chang, Ching Hsiu Tsai, Wen-Chau Liu (1.Institute of Microelectronics, Department of Electrical Engineering, National Cheng-Kung University)

2004 International Conference on Solid State Devices and Materials |PDF Download

[F-2-7] Substrate Parasitic Current in InGaP/GaAs HBTs

Yang-Hua Chang, Yi-Jing Hsieh (1.Department of Electronic Engineering National Yunlin University of Science and Technology, 2.Taiwan Spin Phenomena Integrated Nanotechnology Research Center National Yunlin University of Science and Technology)

2004 International Conference on Solid State Devices and Materials |PDF Download

[F-2-8] Extraction of Temperature Dependent Conduction Band Offset in InGaP/GaAs HBT Using 1-D Simulation

Chih-Hao Liao, Chien-Wei Gwan, Chien-Ping Lee (1.National Chiao Tung Univ., Dept. of Electronics Engineering)

2004 International Conference on Solid State Devices and Materials |PDF Download

[F-3-1] Process Realization for 3-D ICs using Fine Pitch Through Silicon Vias

L. Schaper, S. Spiesshoefer, S. Burkett, G. Vangara, Z. Rahman, S. Polamreddy (1.University of Arkansas, High Density Electronics Center)

2004 International Conference on Solid State Devices and Materials |PDF Download

[F-3-2] Application of High Reliable Silicon Thru-Via to Image Sensor CSP

Kojiro Kameyama, Yoshio Okayama, Mitsuo Umemoto, Akira Suzuki, Hiroshi Terao, Masataka Hoshino, Kenji Takahashi (1.Association of Super-Advanced Electronic Technologies (ASET))

2004 International Conference on Solid State Devices and Materials |PDF Download

[F-3-3] Pyramid Bumps for Fine-Pitch Chip-Stack Interconnection

Naoya Watanabe, Tanemasa Asano (1.Center for Microelectronic Systems, Kyushu Institute of Technology)

2004 International Conference on Solid State Devices and Materials |PDF Download

[F-3-4] Connection Test of Area Bump Using Active-Matrix Switches

Naoya Watanabe, Satoshi Hasegawa, Tanemasa Asano (1.Center for Microelectronic Systems, Kyushu Institute of Technology)

2004 International Conference on Solid State Devices and Materials |PDF Download

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