[C-8-6L] A Novel Compact-Model of Quasi-Ballistic Nanowire MOSFETs

K. Natori¹ (1.Tokyo Inst. Tech.)

2009 International Conference on Solid State Devices and Materials |PDF Download

[D-1-1] Through-Si-Via Technology Solutions for 3D System Integration

E. Beyne¹, B. Swinnen¹, J. V. Olmen¹, D. S. Tezcan¹, A. Jourdain¹, P. Limaye¹ (1.IMEC)

2009 International Conference on Solid State Devices and Materials |PDF Download

[D-1-2] Development of EEB (Electroplated-Evaporation Bumping) Technology for Fine Pitch and Low Resistance Cu/Sn Micro-Bumps

Y. Ohara¹, A. Noriki¹, E. Iwata¹, T. Hiraki¹, K. W. Lee¹, M. Murugesan¹, J. C. Bea¹, T. Fukushima¹, T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ.)

2009 International Conference on Solid State Devices and Materials |PDF Download

[D-1-3] High-Aspect-Ratio Fine Cu Sidewall Interconnection over Chip Edge with Tapered Polymer for MEMS-LSI Multi-Chip Module

A. Noriki¹, Y. Kaiho¹, E. Iwata¹, Y. Ohara¹, M. Murugesan¹, K. W. Lee¹, J. C. Bea¹, T. Fukushima¹, T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ.)

2009 International Conference on Solid State Devices and Materials |PDF Download

[D-1-4] Back-Side Illuminated CMOS Image Sensor Fabricated using Compliant Bump

N. Watanabe¹, I. Tsunoda², T. Takao¹, K. Tanaka³, T. Asano¹ (1.Kyushu Univ.(Japan), 2.Kyushu Inst. Of Tech.(Japan), 3.Kyushu Sangyo Univ.(Japan))

2009 International Conference on Solid State Devices and Materials |PDF Download

[D-1-5] Tantalum lightshield for CMOS image sensor with global shutter

J. Gambino¹, R. J. Rassel¹, A. Watts¹, C. Musante¹, R. Krishnasamy¹, B. Leidy¹, N. Lai¹, T. C. Lee¹, P. Razina¹, C. Walsh¹, B. Czabaj¹, R. Preston¹, D. Demuynck¹, J. Adkisson¹, J. Ellis-Monaghan¹, M. Jaffe¹ (1.IBM)

2009 International Conference on Solid State Devices and Materials |PDF Download

[D-1-6] Nondestructive Warpage Measurements of LSI Chips in a Stacked SiP by using High-Energy X-ray Diffraction

A. Toda¹, N. Ikarashi¹ (1.NEC Corp.)

2009 International Conference on Solid State Devices and Materials |PDF Download

[D-2-1] Wireless Interconnection by Electromagnetic Coupling of Open-Ring Resonators and Its Application to System Integration

Y. Ohno¹, I. Awai² (1.Univ. of Tokushima(Japan), 2.Ryukoku Univ.(Japan))

2009 International Conference on Solid State Devices and Materials |PDF Download

[D-2-2] Transmission Characteristics of Silicon On-chip Integrated Antennas as Millimeter-Wave Wireless Interconnects

W. Moriyama¹, K. Kimoto¹, S. Kubota¹, N. Sasaki¹, T. Kikkawa¹ (1.Hiroshima Univ.)

2009 International Conference on Solid State Devices and Materials |PDF Download

[D-2-3] High Gain and High Directivity UWB Bow-tie Antenna with High Impedance Metamaterial Surface

S. Kubota¹, N. Sasaki¹, Y. Kayaba¹, W. Moriyama¹, T. Kozaki¹, T. Kikkawa¹ (1.Hiroshima Univ.)

2009 International Conference on Solid State Devices and Materials |PDF Download

707 results (91 - 100)

« Prev
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
Next »

▲